Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

Home > Products >

multiscene thermal pad electrical conductivity

Browse Categories

Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

1 - 10 of 360

multiscene thermal pad electrical conductivity

Selling leads

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

...thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color ... 2024-12-09 17:19:32

Thickness 0.5-12mm Ultra Soft Thermal Pad Electrical Conductivity Multiscene

...thermal conductivity with pink thermal pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color ... 2025-01-02 00:10:25

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

...±5 ASTM D2240 Tensile Strength(KN/m) 2.5 ASTM D624 Elongation(%) 60 ASTM D412 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ... 2024-12-09 17:19:13

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

...±5 ASTM D2240 Tensile Strength(KN/m) 2.5 ASTM D624 Elongation(%) 60 ASTM D412 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ... 2025-01-02 00:10:25

Silicone Ultrasoft Heat Conductive Pad , Solid Thermal Pad High Conductivity

Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ... 2024-12-09 17:19:13

Silicone Ultrasoft Heat Conductive Pad , Solid Thermal Pad High Conductivity

Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + ... 2025-01-02 00:10:25

RoHS Silicone Thermal Pad For PC , Multiscene Electrically Conductive Thermal Pad

...±5 ASTM D2240 Tensile Strength(KN/m) 2.5 ASTM D624 Elongation(%) 60 ASTM D412 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ... 2024-12-09 17:19:13

RoHS Silicone Thermal Pad For PC , Multiscene Electrically Conductive Thermal Pad

...±5 ASTM D2240 Tensile Strength(KN/m) 2.5 ASTM D624 Elongation(%) 60 ASTM D412 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ... 2025-01-02 00:10:25

RoHS Multiscene Gap Filler Pad , Acrylate Thermal Pad For Electronics

... Hardness(shore oo) 45±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 ... 2024-12-09 17:19:13

RoHS Multiscene Gap Filler Pad , Acrylate Thermal Pad For Electronics

... Hardness(shore oo) 45±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 ... 2025-01-02 00:10:25

Page 1 of 36 : |< << 1 2 3 4 5 6 7 8 9 10 >> >|