China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multiscene laptop cpu thermal pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multiscene laptop cpu thermal pad

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Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13
Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2025-01-02 00:10:25
Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13
8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2024-12-09 17:19:32
Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2025-01-02 00:10:25
8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2025-01-02 00:10:25
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25
Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25
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