China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multiscene gel potting compound

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multiscene gel potting compound

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High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
High Breakdown Voltage Thermal Conductivity Silicone Encapsulating For Electric Machinery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC Attribute Value Test Method Composition Ceramic ... 2024-12-09 17:19:13
1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
White Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC Attribute Value Test Method Composition Ceramic ... 2024-12-09 22:03:00
1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
White Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
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