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multiscene cpu thermal pad
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Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + .....
2024-12-09 17:19:13
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1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ...
2024-12-09 17:19:13
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0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ...
2024-12-09 17:19:32
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Thermal Conductive Pad with 1.5W/m.K High cut through resistance Low volatility gap filler Attribute Value Test Method Composition Ceramic Filler + .....
2025-01-02 00:10:25
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1.2W/m.K Pink Thermal Conductivity Silicone Pad For Electronic Product Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ...
2025-01-02 00:10:25
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0.25mm Thickness High Breakdown Voltage Thermal Insulation Silicone Pad For Inverter Attribute Value Test Method Product TC1500B - Composition ...
2025-01-02 00:10:25
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ...
2024-12-09 17:19:13
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ...
2025-01-02 00:10:25
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Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ...
2024-12-09 17:19:13
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Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ...
2024-12-09 22:03:00
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