China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multipurpose thermal conductive gap filler

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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multipurpose thermal conductive gap filler

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...Thermal Grease Thermally Conductive Filler Mixture Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive ... 2024-12-09 17:19:13
...Thermal Grease Thermally Conductive Filler Mixture Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive ... 2024-12-09 22:03:00
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2026-04-06 00:29:56
Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56
Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ... 2024-12-09 17:19:13
Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2026-04-06 00:29:56
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