China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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multipurpose silicone thermal paste

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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301 - 310 of 392

multipurpose silicone thermal paste

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Thermally Conductive Encapsulant Gray Elastomer With Moderate Thermal Conductivity Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
...Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) ... 2025-01-02 00:10:25
Thermal Conductive Pad Super soft good thermal insulation with 1.5 W/m.K Ultra Soft Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13
...Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 Hardness(shore oo) 25 ASTM D2240 Elongation(%) >100 ASTM ... 2024-12-09 17:19:13
1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0W/m.K Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13
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