China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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heatproof thermal insulation pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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heatproof thermal insulation pad

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Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + ... 2026-04-06 00:29:56
1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56
Black Thermally Conductive Encapsulant Transparent Silicone Encapsulant For LED Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 17:19:13
Black Thermally Conductive Encapsulant Transparent Silicone Encapsulant For LED Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00
1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic ... 2024-12-09 17:19:13
1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic ... 2026-04-06 00:29:56
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