Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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electronics thermally conductive silicone potting compound

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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electronics thermally conductive silicone potting compound

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RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

PCB Potting Compound, Multipurpose Optically Clear Silicone Encapsulant

High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC Attribute Value Test Method Composition Ceramic ... 2024-12-09 17:19:13

PCB Potting Compound, Multipurpose Optically Clear Silicone Encapsulant

High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC Attribute Value Test Method Composition Ceramic ... 2024-12-09 22:03:00

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 ... 2024-12-09 17:19:13

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Grey Visual Thickness(mm) 0.5~10.0 astm d374 Density(g/cc) 2.8 ASTM D792 ... 2026-04-06 00:29:56

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

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