China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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aok thermal conductive gap filler

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8W/m.K Thermal Conductivity Pink Silicone Soft Thermal Pad Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ... 2026-04-06 00:29:56
Pink 8.0W/m.K Thermal Conductivity 55 Shore OO Hardness Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + ... 2026-04-06 00:29:56
8 W/m.K Thermal Conductivity 55 Shore Oo Hardness Silicone Soft Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2026-04-06 00:29:56
Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56
8.0W/m.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV​ Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56
Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ... 2024-12-09 17:19:13
Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 ... 2024-12-09 22:03:00
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32
Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2026-04-06 00:29:56
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