Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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acrylate thermal pad for electronics

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Ultrasoft Multipurpose Thermal Laptop Pad With Paste Weather Resistant

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 17:19:13

Ultrasoft Multipurpose Thermal Laptop Pad With Paste Weather Resistant

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2025-01-02 00:10:25

Practical Thick Thermal Transfer Pad 45 Shore OO Hardness Multipurpose

...Thermal Pad For Silicon Sensitive Components Attribute Value Test Method Composition Acrylate - Color Green Visual Thickness(mm) 0.5-10.0 ASTM D374 ... 2024-12-09 17:19:13

Practical Thick Thermal Transfer Pad 45 Shore OO Hardness Multipurpose

...Thermal Pad For Silicon Sensitive Components Attribute Value Test Method Composition Acrylate - Color Green Visual Thickness(mm) 0.5-10.0 ASTM D374 ... 2025-01-02 00:10:25

Multipurpose Thermal Silicone Pad Nontoxic For Electronics

Pink High Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:19:32

Multipurpose Thermal Silicone Pad Nontoxic For Electronics

Pink High Thermal Conductivity Thermal Pad Silicone Material For Robots Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2025-01-02 00:10:25

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

0.5 mm Thickness Thermal Conductive Pad Density 2.3 G/CC For Cooling

TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

1.2 W/m.K Ultra Soft Thermal Conductive Pad 10mm Thickness For Electronics

1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

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