Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

141 - 150 of 402 Selling leads

1.8G/CC Durable Thermally Conductive Encapsulant For Power Battery

1.8G/CC Density Thermal Conductivity Silicone Encapsulating For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

UL Certification Heatproof Thermally Conductive Potting Compound For Electronics

White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

Silicone Thermally Conductive Encapsulant UL94-V0 Flammability For Sensor

UL94-V0 Flammability Thermal Conductivity Silicone Encapsulating For Sensor Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

AOK White High Temperature Potting Compound , Electrically Insulating Thermal Silicone Glue

White Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

Flame Retardant Thermally Conductive Encapsulant Dustproof For Power Battery

Low Thermal Resistance 0.8W/m.K Thermally Conductive Silicone Encapsulant For Power Battery Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Thermal conductive materials Organic Silicone, Thermal Conductive Gap Filler

Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - ... 2024-12-09 22:03:00

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