Multiscene Silicone Free Thermal Pad 2 W/m.K Ultrasoft High Performance

Application of silicon free thermal pad:
Hard disk
Optical precision equipment
Notebook computer, projector and OA office electronic products
Mobile and communication equipment, high-speed mass
Storage drives, heat pipe assemblies, automotive engine control equipment
Telecommunication hardware and equipment, high-end industrial control and medical electronics

Product feature
■ Thermal conductivity: 2.0,3.0 W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.

■ No siloxane volatilization

■ High thermal conductivity

■ High insulation

■ High compressibility

Typical applications
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk

■ Optical precision equipment

■ Notebook computer, projector and OA office electronic products

■ Mobile and communication equipment, high-speed mass

■ Storage drives, heat pipe assemblies, automotive engine control equipment

■ Telecommunication hardware and equipment, high-end industrial control and medical electronics