China Integrated Circuit Chip manufacturer
ShenZhen Mingjiada Electronics Co.,Ltd.
Shenzhen Mingjiada Electronics Co., Ltd.
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lga package 5g module

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ShenZhen Mingjiada Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0755-83294757

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lga package 5g module

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... Automotive IGBT Modules SOT-227-4​ Product Description Of IXYN50N170CV1 IXYN50N170CV1 is 1700V/120A High Voltage XPT IGBT with Diode, Chassis ... 2024-12-09 22:24:04
... controller integrates MAC and PHY with I-grade support. 7x7mm. Specification Of AQC115C-B1-C Part Number: AQC115C-B1-C Network Rates: 2.5G and ... 2025-07-30 00:16:27
...reduces system operating cost. Specification Of BCM84885B0KFEBG Part Number: BCM84885B0KFEBG Ambient Temperature(Min): 70°C Package: BGA Size: 17 ... 2025-07-30 00:15:37
...-TX Ethernet CMOS transceiver. Specification Of BCM84881B0IFSBG Part Number: BCM84881B0IFSBG Package: BGA169 Size: 11 Mm × 11 Mm Port: Single Port ... 2025-07-30 00:15:37
... a wide variety of configurations consisting of 1G,2.5G, 10G and 25G Ethernet ports. Specification Of VSC7552TSN-V/5CC Part Number VSC7552TSN-V/5CC ... 2025-07-30 00:15:37
...200 MHz, 4MB of Flash Memory, the package is 292-LFBGA, Programmable HSM (Hardware Security Module). Specification Of SAK-TC277TP-64F200N DC Part ... 2025-07-30 00:15:51
...package is 448-FBGA (17x17). Single core, 1.0GHz, -40 to 105C, Security enabled. Product Attributes Of LS1017AXE7KQA Part Number: LS1017AXE7KQA ... 2024-12-09 21:41:08
....Package is BGA. Specification Of APL109C/343S00554 Part Number: APL109C/343S00554 CPU: 6 Core: 64Bit SDRAM: 6 GB Product Images Of APL109C... 2025-07-30 00:16:35
...Package is BGA. Specification Of 343S00517 Part Number: 343S00517 Mounting Type: Surface Mount Product Status: Active Type: Iphone IC Chip Product ... 2025-07-30 00:16:35
...Module® solution. ADAQ8092BBCZ device incorporates signal conditioning, an analog-to-digital (ADC) driver, a voltage reference, and an ADC in a ... 2025-07-30 00:16:17
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