1571 - 1580 of 1604
in5665fc ai processor chip
Selling leads
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...-LQFP (24mm x 24mm), Surface Mount. Specification Of STM32F427IGT6 Part Number: STM32F427IGT6 Program Memory Size: 1MB (1M X 8) Core Processor: ARM...
2025-07-13 00:16:03
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... with 32 message objects and up to 7.5 Mbit/s capability; usable as second CAN when not used as safety port. Specification Of SPC560P50L3CEFAR Part ...
2025-07-13 00:16:02
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... KB on-chip flash, up to 128 KB of on-chip SRAM,FlexSPI with cache, USB Full-Speed device with crystal-less operation, USB Full-Speed Host, CAN FD. ...
2024-12-09 22:19:48
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... Logic Cells, AI Core Versal, the package is BGA. Specification Of XCVC1502-2MLEVBVA Part Number: XCVC1502-2MLEVBVA I/O: 114 – 530 Speed: 400MHz, ...
2024-12-09 21:37:54
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.... The package is BGA. Specification Of XCVC1502-2LSEVBVA Part Number: XCVC1502-2LSEVBVA Peripherals: DDR, DMA, PCIe Primary Attributes: Versal AI ...
2024-12-09 21:37:54
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...Chip, the package is BGA, Connecting between the processing system and DDR memory, Sharing device access to DRAM (DDR memory). Specification Of ...
2024-12-09 21:37:54
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... of data L1 cache, with parity and ECC protection respectively. Specification Of XCVC1502-1LSIVSVG Part Number: XCVC1502-1LSIVSVG Data Memory(AI ...
2024-12-09 21:37:54
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...tem On Chip (SoC), 80k Logic Cells 400MHz, the package is 1596-BGA (37.5x37.5). Specification Of XCVC1502-1LLIVSVA Part Number XCVC1502-...
2024-12-09 21:38:10
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Wireless Communication Module ESP8684-WROOM-06C 120MHz 32bit RISC-V single core processor Description The ESP8684-WROOM-06C is based on the ESP8684 ...
2025-07-02 00:18:49
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... Chip IC Product Description Of SAK-TC397XP-256F300S BC SAK-TC397XP-256F300S BC Powerful next-generation AURIX™ TC3xx system architecture. ...
2024-12-09 21:36:46
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