441 - 450 of 499
bga package power amplifier chip
Selling leads
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... time-base for the system, available in any reduced power modes. Specification Of LPC5516JBD100 Part Number: LPC5516JBD100 Package / Case: 100-LQFP ...
2024-12-09 23:37:01
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... request sources. Specification Of SPC560P60L3CEFAR Part Number: SPC560P60L3CEFAR Size: 14mm X 14mm A/D Data Converters: A/D 16x10b RAM Size: 80K X ...
2025-07-31 00:22:18
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... high accuracy measurements with very low power consumption, in an ultra-compact WLCSP (Wafer Level Chip Scale Package). HDC2010YPAR provides high ...
2025-07-30 00:16:37
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...Package LCMXO2-7000HC-4FTG256I MachXO2 Field Programmable Gate Array Product Description Of LCMXO2-7000HC-4FTG256I LCMXO2-7000HC-4FTG256I devices ...
2024-12-09 21:35:22
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...Low dynamic power with integrated DC-DC converter. Specification Of MIMXRT1176CVM8A Part Number MIMXRT1176CVM8A Speed 800MHz Connectivity CANbus, ...
2024-12-09 21:36:46
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...-bit 56800EX core. On a single chip, each device combines the processing power of a DSP and the functionality of an MCU. Specification Of ...
2025-07-31 00:22:06
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... power supply,up to 1-MB flash memory. Specification Of R5F572TKCDFB#30 Part Number R5F572TKCDFB#30 Peripherals DMA, LVD, POR, PWM, ...
2025-07-31 00:22:05
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... Package R5F572MNDDBD Single-Core 240MHz Embedded Microcontrollers IC Product Description Of R5F572MNDDBD R5F572MNDDBD is 5V-compatible devices ...
2024-12-09 22:36:35
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...Power Management Chip, USB, Type-C Controller, package is 96-BGA(6x6), Surface Mount. Product Attributes Of TPS65983ACZQZR Part Number TPS65983ACZQ...
2025-07-31 00:22:25
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....Package is BGA. Specification Of CD3217B13HACER Part Number: CD3217B13HACER Type: Iphone IC Chip Package: BGA Application: USB-C Controller ...
2025-07-30 00:16:35
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