561 - 570 of 4142
bga package memory chips
Selling leads
...Chip IS22TF08G-JCLA2 8GB eMMC 5.1 Interface 153-VFBGA Memory IC Product Description Of IS22TF08G-JCLA2 IS22TF08G-JCLA2 is 8GB eMMC Memory Chip ...
2024-12-09 22:24:04
|
...Memory IC Chip 4 GB eMMC Memory IC FBGA-153 Package Product Description Of THGBMNG5D1LBAIL THGBMNG5D1LBAIL is 4 GB eMMC Memory IC,the package is ...
2025-01-10 07:30:17
|
Serial NAND Flash Memory MT29F1G01ABAFDSF-AAT:F 16-SOIC Integrated Circuit Chip Product Description Of MT29F1G01ABAFDSF-AAT:F MT29F1G01ABAFDSF-AAT:F ...
2024-12-09 22:19:48
|
FLASH NAND Memory IC MT29F8G08ADAFAH4-AAT:F 63-VFBGA Integrated Circuit Chip Product Description Of MT29F8G08ADAFAH4-AAT:F MT29F8G08ADAFAH4-AAT:F is ...
2024-12-09 22:19:48
|
Memory IC Chip MT53E256M32D2DS-046 AAT:B 8Gbit SDRAM Mobile LPDDR4 Memory IC Product Description Of MT53E256M32D2DS-046 AAT:B MT53E256M32D2DS-046 AAT...
2025-07-30 00:16:31
|
... CMOS dynamic random access memory. The memory device is designed in multi-chip package (MCP) and package stack (PoP) to save PCB space. The LPDDR4 ...
2025-07-30 00:16:31
|
Memory IC Chip MT53E1G64D4NW-046 WT:C 64 Gbit SDRAM LPDDR4 Memory IC 432-VFBGA Product Description Of MT53E1G64D4NW-046 WT:C MT53E1G64D4NW-046 WT:C ...
2025-07-30 00:16:31
|
... mode is reduced to 1/5. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 ...
2025-07-30 00:16:31
|
...-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 configurations to save BOM ...
2025-07-30 00:16:31
|
Power Management IC PM8150L Integrated Circuit Chip PM8150 Medium Frequency Product Description Of PM8150L PM8150L is Power Management IC, Medium ...
2025-07-30 00:15:56
|