3821 - 3830 of 4142
bga package memory chips
Selling leads
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... AIR/performance manager ic. Specification Of APL109D/343S00555 Part Number: APL109D/343S00555 Type: Iphone IC Chip Package: BGA GPU: 5 Product ...
2025-06-22 00:16:23
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... Chip, Special use for Apple 13/13Pro/13ProMax/Mini Camera Power Supply. Specification Of 338S00762 Part Number: 338S00762 Product Type: Camera ...
2025-06-22 00:16:23
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....Package is BGA. Specification Of SN012776B0YBHR Part Number SN012776B0YBHR Mounting Type Surface Mount Product Status Active Product Images Of ...
2024-12-09 21:46:53
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... transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces. ...
2024-12-09 21:46:53
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...memory that can be used for storing programs and data. STM32H723xE/G devices are offered in several packages ranging from 100 to 144 pins/balls. ...
2025-07-28 00:18:48
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...DSP with FPU, Arm Cortex-M7 MCU. The package is 100-LQFP (14x14). Specification Of STM32F767VIT6 Part Number: STM32F767VIT6 Flash Memory: Up To 2 ...
2025-07-28 00:19:09
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... supply. Dedicated supply inputs for USB and SDMMC2 are available on all the packages except LQFP100 for a greater power supply choice.Advanced ...
2025-07-28 00:19:09
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...ARM Cortex M7 Microcontroller IC, incorporate high-speed embedded memories with a Flash memory up to 512 Kbytes, the package is 100-LQFP (14x14). ...
2025-07-28 00:19:38
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... of ultralow quiescent current, high input voltage, and miniaturized, high-thermal-performance packaging. TPS7A1650QDGNRQ1 devices are designed for ...
2025-07-28 00:19:23
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8-SOIC ISO6721BQDRQ1 Dual-Channel Automotive Digital Isolators With Robust EMC Product Description Of ISO6721BQDRQ1 ISO6721BQDRQ1 devices are high...
2025-07-28 00:19:26
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