1151 - 1153 of 1153
bcm85812a0 die ethernet ic
Selling leads
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...Circuits (ICs), Embedded - FPGAs (Field Programmable Gate Array), Surface Mount, package is 144-LQFP. Specification Of XC6SLX4-2TQG144C Part Number...
2025-07-24 00:24:10
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... Temperature is -40°C ~ 100°C (TJ). Specification Of XC6SLX75-3FGG676I Part Number: XC6SLX75-3FGG676I Die Input Capacitance At The Pad(Max): 10 PF ...
2024-12-09 22:01:59
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... Gate Array (FPGA) IC, package is 484-FBGA (23x23), Surface Mount. Specification Of XC7A100T-2FG484C Part Number: XC7A100T-2FG484C I/O Input ...
2024-12-09 22:08:10
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