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Beijing Qianxing Jietong Technology Co., Ltd.

City: beijing

Province/State:beijing

Country/Region:china

Tel:86--13426366826

Contact Person:
Ms.Sandy Yang
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AMD EPYC 2U Rack Server Dell PowerEdge R7525 Rack Server Highly Scalable

Brand Name DELL EMC
Model Number PowerEdge R7525 Rack Server
Place of Origin China
Minimum Order Quantity 1
Price $2680-5680 pcs Negotiable
Payment Terms T/T
Supply Ability 50/pcs/week
Delivery Time 5-8 working days
Packaging Details Carton Packaging
Processor Up to two 2nd or 3rd Generation AMD EPYCTM Processors with up to 64 cores per processor
Memory Module Slots 32 DDR4 RDIMM or LRDIMM
Front Bays Up to 12 x 3.5” SAS/SATA (HDD)
Internal Controllers HBA345, PERC H345, PERC H745
External Controllers H840, 12Gbps SAS HBA
Slots PCIe Up to 8 x PCIe Gen4 slots
Detailed Product Description

High Quality AMD EPYC 2U Rack Server Dell PowerEdge R7525 GPU Server highly scalable two-socket 2U rack server

Dell EMC PowerEdge R7525

 

Introduction
The Dell EMC PowerEdge R7525 is a two socket, 2U rack servers that is designed to run workloads using flexible I/O and network configurations. The PowerEdge R7525 features the AMD® EPYC™ Generation 2 and Generation 3 processors, supports up to 32 DIMMs, PCI Express (PCIe) Gen 4.0 enabled expansion slots, and a choice of network interface technologies to cover networking options. The PowerEdge R7525 is designed to handle demanding workloads and applications, such as data warehouses, ecommerce, databases, and high-performance computing (HPC).
 

The following table shows the new technologies for the PowerEdge R7525:

TechnologyDetailed Description
AMD® EPYC™ Generation 2 and
Generation 3 processors.
● 7 nm processor technology
● AMD Interchip global memory interconnect (xGMI) up to 64 lanes
● Up to 64 cores per socket
● Up to 3.8 GHz
● Max TDP: 280 W
3200 MT/s DDR4 memory● Up to 32 DIMMs
● 8x DDR4 Channels per socket, 2 DIMMs per channel (2DPC)
● Up to 3200 MT/s (configuration-dependent)
● Supports RDIMM, LRDIMM, and 3DS DIMM
PCIe Gen and slot● Gen 4 at 16 T/s
Flex I/O● LOM board, 2 x 1G with BCM5720 lan controller
● Rear I/O with 1 G dedicated management network port
● One USB 3.0, one USB 2.0 and VGA port
● OCP Mezz 3.0
● Serial port option
CPLD 1-wire● Support payload data of front PERC, Riser, backplane and rear I/O to BIOS and IDRAC
Dedicated PERC● Front storage module PERC with front PERC 10.4
Software RAID● Operating system RAID/PERC S 150
iDRAC9 with Lifecycle ControllerThe embedded systems management solution for Dell servers features hardware and
firmware inventory and alerting, in-depth memory alerting, faster performance, a
dedicated Gb port and many more features.
Wireless ManagementThe Quick Sync feature is an extension of NFC-based low-bandwidth interface. Quick
Sync 2.0 offers feature parity with the previous versions of the NFC interface with
improved user experience. To extend this Quick Sync feature to wide variety of Mobile
OSs with higher data throughput, the Quick Sync 2 version replaces previous generation
NFC technology with wireless at-the-box system management.
Power supply● 60 mm / 86 mm dimension is the new PSU form factor
● Platinum Mixed Mode 800 W AC or HVDC
● Platinum Mixed Mode 1400 W AC or HVDC
● Platinum Mixed Mode 2400 W AC or HVDC
Boot Optimized Storage
Subsystem S2 (BOSS S2)
Boot Optimized Storage Subsystem S2 (BOSS S2) is a RAID solution card that is designed
for booting a server's operating system that supports up to:
● 80 mm M.2 SATA Solid-State Devices (SSDs)
● PCIe card which is a Single Gen2 PCIe x 2 host interface
● Dual SATA Gen3 device interfaces
Liquid cooling solution● The new liquid cooling solution provides efficient method to manage the system
temperature.
● It also provides liquid leak detection mechanism via iDRAC. This technology is managed
by the Liquid Leak Sensor (LLS) mechanism.
● LLS determines leaks as small as 0.02 ml or as large as 0.2 ml.

 

 

Product comparison

FeaturePowerEdge R7525PowerEdge R7425
ProcessorTwo AMD® EPYC™ Generation 2 or
Generation 3 processors.
Two AMD Naples™ socket SP3
compatible processors
CPU InterconnectInter-chip global memory interconnect
(xGMI-2)
AMD Socket to Socket Global Memory
Interface (xGMI)
Memory32x DDR4 RDIMM, LRDIMM, 3DS32x DDR4 RDIMM, LRDIMM
Disk Drives3.5-inch, 2.5-inch: 12G SAS, 6G SATA,
NVMe HDD
3.5-inch, 2.5-inch: 12G SAS, 6G SATA
HDD
Storage ControllersH755, H755N, H745, HBA345, HBA355,
H345, H840, 12G SAS HBA
SW RAID: S150
Adapters: H330, H730P, H740P, H840 ,
HBA330, 12G SAS HBA
SW RAID: S140
PCIe SSDUp to 24x PCIe SSDUp to 24x PCIe SSD
PCIe SlotsUp to 8 (PCIe 4.0)Up to 8(Gen3 x16)
rNDC2 x 1 GBSelect Network Adapter NDC: 4 x 1 GB,
4 x 10 GB, 2 x 10 GB + 2 x 1 GB, or 2 x
25 GB
OCPYes for OCP 3.0NA
USB PortsFront: 1 x USB 2.0, 1 x iDRAC USB
(Micro-AB USB)
Rear: 1 x USB 3.0, 1 x USB 2.0
Internal: 1 x USB 3.0
Front: 1 x USB2.0, 1 x iDRAC USB(Micro
USB) , Optional 1xUSB 3.0 front port
Rear: 2 x USB3.0
Internal: 1 xUSB3.0
Rack Height2U2U
Power SuppliesMixed Mode (MM) AC/HVDC (Platinum)
800 W, 1400 W, 2400 W
AC Platinum : 2400 W, 2000 W, 1600 W,
1100 W, 495 W
750 W AC Platinum: Mixed Mode HVDC
( for China only), Mixed Mode AC, DC
( DC for China only)
1100 W -48 V DC Gold
System ManagementLC 3.x, OpenManage, QuickSync2.0,
OMPC3, Digital License Key, iDRAC
Direct (dedicated micro-USB port), Easy
Restore
LC 3.x, OpenManage, QuickSync 2.0,
Digital License Key, iDRAC9, iDRAC
Direct (dedicated micro-USB port), Easy
Restore, vFlash
GPU3 x 300 W (DW) or 6 x 75 W (SW)3 x 300 W (DW) or 6 x 150 W (SW)
AvailabilityHot-plug drives, Hot-plug redundant
power supplies, BOSS, IDSDM
Hot-plug drives, Hot-plug redundant
power supplies, BOSS, IDSDM

 

 

Chassis views and features
Front view of the system

Figure 1. Front view of the 24 x 2.5-inch drive system
1. Left control panel
2. Drive (24)
3. Right control panel
4. Information tag

 

Figure 2. Front view of the 16 x 2.5-inch drive system
1. Left control panel
2. Drive (16)
3. Right control panel
4. Information tag

Figure 3. Front view of the 8 x 2.5-inch drive system
1. Left control panel
2. Drive (8)
3. Right control panel
4. Information tag

Figure 4. Front view of the 12 x 3.5-inch drive system
1. Left control panel
2. Drive (12)
3. Right control panel
4. Information tag

Figure 5. Front view of the 8 x 3.5-inch drive system
1. Left control panel
2. Optical Drive blank
3. Drive (8)
4. Right control panel
5. Information tag

 

Rear view of the system

1. PCIe expansion card riser 1 (slot 1 and slot 2)
2. BOSS S2 card (optional)
3. Rear Handle
4. PCIe expansion card riser 2 (slot 3 and slot 6)
5. PCIe expansion card riser 3 (slot 4 and slot 5)
6. USB 2.0 port (1)
7. PCIe expansion card riser 4 (slot 7 and slot 8)
8. Power supply unit (PSU 2)
9. VGA port
10. USB 3.0 port (1)
11. iDRAC dedicated port

12. System identification button
13. OCP NIC port (optional)
14. NIC port (1,2)
15. Power supply unit (PSU 1)

Figure 6. Rear view of the system with 2 x 2.5-inch rear drive module
1. PCIe expansion card riser 1 (slot 1 and slot 2)
2. BOSS S2 card (optional)
3. Rear Handle
4. PCIe expansion card riser 2 (slot 3 and slot 6)
5. Rear drive module
6. USB 2.0 port (1)
7. PCIe expansion card riser 4 (slot 7 and slot 8)
8. Power supply unit (PSU 2)
9. VGA port
10. USB 3.0 port (1)
11. iDRAC dedicated port

12. System identification button
13. OCP NIC port (optional)
14. NIC port (1,2)
15. Power supply unit (PSU 1)

 

Inside the system

Figure 7. Inside the system
1. Handle

2. Riser 1 blank
3. Power supply unit (PSU 1)

4. BOSS S2 card slot
5. Riser 2

6. Heat sink for processor 1
7. Memory DIMM socket for processor 1 (E,F,G,H)

8. Cooling fan assembly
9. Service tag

10. Drive backplane
11. Cooling fan cage assembly

12. Memory DIMM socket for processor 2 (A,B,C,D)
13. Heat sink for processor 2

14. System board
15. Power supply unit (PSU 2)

16. Riser 3 blank
17. Riser 4 blank

Figure 8. Inside the system with full length risers
1. Cooling fan cage assembly

2. Cooling fan
3. GPU air shroud

4. GPU air shroud top cover
5. Riser 3

6. Riser 4
7. Handle

8. Riser 1
9. Drive backplane

10. Service tag
 

Notices:

 

1. Open the packaging, check the products carefully, and take them gently.

2. The product is a brand new original unopened equipment.

3. All products 1 year warranty, and the buyer is responsible for the return shipping cost.

 

International Buyers Please Note:
Import duties, taxes, and charges are not included in the item price or shipping cost. These charges are the buyer's responsibility.
Please check with your country's customs office to determine what these additional costs will be prior to bidding or buying.
Customs fees are normally charged by the shipping company or collected when you pick the item up. These fees are not additional shipping charges.
We won't under-value merchandise or mark the item as a gift on customs forms. Doing that is against U.S. and international laws.
Customs delays are not the responsibility of the seller.

Product Tags: AMD EPYC 2U Rack Server   Dell PowerEdge R7525 Rack Server   dell poweredge r7525 server  
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