China 3D AOI Machine manufacturer
Dongguan MENTO Intelligent Technology Co., Ltd.
Manufacturer of industrial production line inspection equipment
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integrated semiconductor inspection equipment

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Dongguan MENTO Intelligent Technology Co., Ltd.

Province/State:guangdong

Country/Region:china

Tel:00-86-14775950818

Contact Person:
Mr.Asako
View Contact Details
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integrated semiconductor inspection equipment

Selling leads
... to cater to different inspection requirements, making it possible to detect even the slightest defects on the PCB surface. The AOI Inspection ... 2026-04-19 00:34:50
..., allowing them to make quick decisions and adjustments as needed. It also helps to reduce the risk of errors and defects, which can lead to costly ... 2026-04-19 00:34:50
Product Description: The AOI Inspection Equipment comes equipped with a large inspection area that allows for the inspection of large and complex ... 2026-04-19 00:34:50
...Inspection Equipment utilizes a high-resolution camera system to capture detailed images of your products. This camera system is capable of ... 2026-04-19 00:34:50
...Inspection Equipment is designed to provide maximum inspection accuracy and speed. With high-resolution capabilities, it provides a clear and ... 2026-04-19 00:34:50
Product Description: One of the standout features of the AOI PCB Machine is its operating system. It runs on Windows 10, which means it is compatible ... 2026-04-19 00:34:50
M2020-2012EL Mini LED appearance & luminescence all-in-one Model M2020-2012EL Detection capacity Inspection items Missed bonding, wrong bonding, die ... 2025-06-08 05:31:38
M20EL Series Mini LED luminescence inspection Model M2012EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly ... 2026-04-19 00:34:50
Model M20 Series Mini LED appearance inspection M2065 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, ... 2026-04-19 00:34:50
Model M20 Series Mini LED appearance inspection M2020 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, ... 2026-04-19 00:34:50
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