Rozee Electronics Co., Ltd
Since its establishment in 2015, Rozee Electronics Co., Ltd. has
been supporting the supply chain of OEM, CM, EMS companies and
global distributors. Rozee Electronics Co., Ltd. is a comprehensive
agent distributor of active and passive components. Product
applications cover power security, network communications,
industrial control instruments, automotive electronics, consumer
electronics and other industries. Partners include domestic trade
peers, electronic product manufacturers, scientific research
institutes and many multinational companies. We can use millions of
components, mainly integrated circuits, semiconductors, storage, RF
Connectors, AVIATION Connectors, MCU, transistors, relays,
Capacitors, Inductors etc. Rozee Electronics has long-term and close cooperation with more than 3,000 suppliers (such as Arrow, Avnet, WPG, Future, Mouser, CEAC, Serial, etc.) in more than 30 countries and regions on four continents with developed electronics industries, helping customers find better component ordering channels, mastering the global component inventory resources of more than tens of billions of US dollars, and helping customers achieve accurate docking with global spot supply. Ruizhi Electronics Co., Ltd. is committed to improving customer
satisfaction. We are proud to be able to successfully meet your
electronic component needs and meet your expectations. Our team is
guided by our core values and our daily mission is to
continuously improve every aspect of our company. Our financial backing also enables long-term growth through empowering terms. Whether you have immediate sourcing needs or seek to optimize your supply chain, we have the capabilities and vision to tackle your challenges. Partner with us to strengthen your supply chain for today and the future. |
- Basic Information
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Company Name: Rozee Electronics Co., Ltd Employee Number: >100 Factory Location: Flat A1-H, 10 / F, Block A, Yue Lam Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung, Hong Kong - Trade & Market
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Company slogan: Rozee Electronic LimitedAbout quality management: QUALITY IS THE FOUNDATION OF EVERYTHING WE DO
In a world of non-stop disruption, Rozee unwavering commitment to upholding international quality, environmental, and electronic-industry-specific standards has led to a spate of certifications. These include the ISO 9001:2015 Certified classifications. By demanding such exacting standards, Roee guarantees that all of its globally sourced product has been subjected to rigorous inspection and evaluation.
External Visual Inspection
Appearance test refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements and proper outer packaging. Secondly, the appearance inspection of a single chip mainly includes: the typing of the chip, Date code, the country of origin, whether it has been re-coated, the state of the pins, whether there are re-grinding marks, unknown residues, and the location of the manufacturer's LOGO.
Programming
Our laboratory is equipped with a variety of programming equipment, which can support the programming and programming of 103,477 ICs produced by 405 IC manufacturers. Provides detection of logic devices including: EPROM, Parallel and Serial EEPROM, FPGA, Configuration Serial PROM, Flash, BPROM, NOVRAM, SPLD, CPLD, EPLD, Microcontroller, MCU and Standard.
X-Ray
X-ray testing is a real-time non-destructive analysis to check the hardware components inside the components, mainly checking the lead frame of the chip, wafer size, gold wire bonding map, ESD damage and holes.
Baking and Dry Packing
Standard professional baking and vacuum packaging can protect the chip from moisture damage and maintain chip availability and reliability, refer to the standard J-STD-033B.1.
Electrical and Temperature Testing
According to the device pins and related instructions specified by the manufacturer in the specification, use a semiconductor tube characteristic grapher to check whether the chip is damaged through open circuit and short circuit tests.
Soderability Test
According to the test standard of the solderability test, this test mainly detects whether the tinning ability of the chip pins meets the standard.
Decapsulation
Uncovering (unsealing) mainly uses instruments to corrode the package on the surface of the chip, check whether there is a wafer inside, the size of the wafer, the logo of the manufacturer, the copyright year, and the wafer code, which can determine the authenticity of the chip.Our Team: We have professional technician team all in this area, welcome customers from all over the world visit our website, and inform us if you have any needs, we are looking forward to give you good services!
- Factory Information
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Market name: Worldwide Contact Person: Mr.Rozee-Tyler Contact Phone: 86-755-83937587