Polyimide-film-based, precision-laminated copper substrate for flexible circuits
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Polyimide-film-based, precision-laminated copper substrate
for flexible circuits Product Overview: The GL series is a leap forward in polyimide film performance. Its proprietary manufacturing process creates a uniquely oriented molecular structure, boosting essential properties like tensile strength, dimensional stability, and chemical resistance by a consistent 30%. This versatile, naturally yellow film is available in custom thicknesses and is the ideal solution for demanding uses such as adhesive substrates and advanced chip packaging. Place of Origin: ANHUI, CHINA Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM, 520MM, 1028MM, 1040MM Thickness: custom Packaging: vacuum packaging Supply Ability: 2000 ton/year Product Features: Robust Mechanical Durabilit Exceptional Dimensional Integrity Excellent Lamination Performance Product Applications: Serves as a base material for high-precision adhesive Flexible
Copper Clad Laminates (FCCL) Product Images: Company Image: |
| Product Tags: flexible circuit copper substrate precision laminated polyimide film copper clad polyimide film |
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High-Mechanical-Strength Copper-Clad Polyimide Film for Flexible Circuitry, RoHS Certified |
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Copper Clad Polyimide Film for Flexible Circuitry Applications with Robust Mechanical Durability and RoHS Compliance |
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Copper Clad Polyimide Film—Copper-coated polyimide film for flexible circuit applications |
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Copper Clad Polyimide Film—Polyimide film coated with copper, used in flexible circuits |
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Copper Clad Polyimide Film—Polyimide film coated with copper, used in flexible circuits |
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Polyimide film with copper coating employed in flexible circuit contexts |