Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
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Precision-Laminated Copper Polyimide Film Functional
Substrate for Flex Circuitry Product Overview: The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging. Place of Origin: ANHUI, CHINA Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM, 520MM, 1028MM, 1040MM Thickness: custom Packaging: vacuum packaging Supply Ability: 2000 ton/year Product Features: Outstanding Mechanical Strength Exceptional Dimensional Stability Superior Laminating Properties Conforms to RoHS and REACH regulations. Product Applications: The GL high-performance polyimide film is primarily used in: High-precision adhesive FCCL substrates High-stability cover films Chip packaging Special adhesive tape substrates Handling & Storage Instructions: To ensure the longevity and performance of our Polyimide film:
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| Product Tags: precision-laminated copper polyimide film flex circuitry functional substrate copper clad polyimide film substrate |
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High-Mechanical-Strength Copper-Clad Polyimide Film for Flexible Circuitry, RoHS Certified |
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Copper Clad Polyimide Film for Flexible Circuitry Applications with Robust Mechanical Durability and RoHS Compliance |
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Copper Clad Polyimide Film—Copper-coated polyimide film for flexible circuit applications |
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Copper Clad Polyimide Film—Polyimide film coated with copper, used in flexible circuits |
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Copper Clad Polyimide Film—Polyimide film coated with copper, used in flexible circuits |
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Polyimide film with copper coating employed in flexible circuit contexts |