What are the advantages of HDI circuit boards?:
An HDI PCB (High Density Interconnect Printed Circuit Board) is a specialized
type of circuit board that has a higher wiring density per unit
area compared to conventional PCBs.It uses advanced technologies like microvias, blind and buried vias, and fine lines and spaces to pack more components and connections into a smaller footprint.
Why choose custom HDI?:
Choosing a custom PCB means you get exactly what your project
needs, not a generic design that compromises on performance.
Off‑the‑shelf boards are built for mass markets, so they often
include unnecessary features while lacking the specific
connections, power delivery, or layout you require. With a custom
PCB, you can optimize the layout for shorter signal paths, better
cooling, and improved stability—critical for high‑speed CPUs, GPUs,
and memory. You also gain full control over component selection,
allowing you to prioritize quality, cost, or specific technologies.
Production process flow:
1.Design and Engineering Preparation
The client provides design files (such as Gerber files), and the
engineering team conducts Design for Manufacturability (DFM)
analysis, optimizing the layout to ensure microvia and trace
accuracy, while selecting appropriate substrate materials (such as
FR-4 or high-frequency laminates).
2.Inner Layer Fabrication and Drilling
Fabricating inner-layer circuits on the substrate: Copper layers
are etched to form circuits via photolithography, followed by laser
drilling (or mechanical drilling) to create microvias (typically
with diameters less than 0.15mm) for high-density interconnections.
3.Pore metallization and lamination
Chemically plate the holes with copper or fill them with conductive
materials to make the hole walls conductive; then laminate all
inner and outer layers together under high temperature and pressure
to ensure precise alignment of each layer.
4.Outer Layer Manufacturing and Surface Treatment
Add outer layer circuit: After graphic transfer and etching,
perform surface treatment (such as gold immersion, OSP, or silver
immersion) to enhance solderability and oxidation resistance.
5.Testing and Final Processing
Conduct rigorous circuit function testing (including AOI and
electrical testing), confirm defect-free results, then proceed with
trimming, cleaning, and packaging for shipment.
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PCB Quality Testing
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