XRay NDT System High Accuracy Void Detection for Electronic Parts and SMT
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Detailed Product Description
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XRay NDT System High Accuracy Void Detection for Electronic Parts
and SMT Industrial SMT PCB X-Ray Inspection Equipment WELLMAN X6000
delivers automated batch inspection with high-precision imaging for
BGA solder voids and PCB through-holes. Key Advantages
Working Principle X6000 X-ray inspection system working principle Technical Specifications X-ray Source
Flat Panel Detector
Work Table
Equipment Parameters
Safety Features
Software Capabilities Basic Operation Full keyboard and mouse control for all functions, including X-ray
tube activation and parameter adjustment. Measurement Tools Comprehensive measurement functions including distance, angle,
radius, perimeter, and distance rate calculations for through-hole
soldering analysis. Automated Inspection Three modes available: manual point setting, array pattern for
regular points, and automatic feature recognition to enable
efficient batch processing. Image Processing Adjustable brightness, contrast, and gain to achieve optimal image
quality. Save and retrieve inspection parameters for repeated
inspections. Voids Rate Measurement Automatically calculates solder ball void rate, area and
circumference, identifies defects, and supports manual void marking
as well as parameter saving to ensure stable and consistent
results. Application Examples X6000 inspection application example 1 X6000 inspection application example 2 |
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| Product Tags: XRay NDT system for electronic parts high accuracy void detection machine SMT XRay inspection system |
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