Waterproof Electrical Potting Compound For Power Electronics
Product Description
BZ-3903 is a two-component addition-cure Electrical Potting Compound optimized for power electronics requiring superior waterproof
sealing and environmental protection, featuring excellent fluidity,
thermal conductivity (≥0.8 W/m·K), and wide temperature tolerance
(-60~200℃). With a 1:1 mix ratio and balanced pot life of 45±15
minutes at 25℃, it supports both manual and automated production
processes while providing exceptional electrical insulation,
vibration resistance, and weatherability. As an addition-cure
product, it cures without releasing volatile byproducts, making it
suitable for sealed assemblies and sensitive electronic components
exposed to harsh environmental conditions.
Key Product Features
- Superior Waterproof Sealing: Formulated with hydrophobic additives to achieve IPX7 waterproof
rating after full curing, effectively protecting electronic
components from moisture, dust, and corrosive substances
- Efficient Heat Dissipation: Contains high-quality thermal fillers to create an efficient heat
conduction path, ensuring reliable heat transfer from power
components to heat sinks or housings
- Wide Temperature Stability: Maintains consistent mechanical and electrical properties across
-60℃ to 200℃, ensuring reliable performance in extreme operating
environments
- Exceptional Weatherability: Resists UV radiation, ozone, and chemical corrosion, providing
long-term protection for outdoor and industrial applications
- Balanced Operational Time: 45±15 minute pot life at 25℃ provides sufficient time for complex
manual operations while supporting efficient automated production
lines
Technical Parameters
Parameters | Part A BZ-3903 | Part B BZ-3903 |
Before curing | Appearance | Grey liquid | Milky white liquid |
Viscosity(mPa·s.25℃) | 2250±750 | 2250±750 |
Initial mixed viscosity(mPa·s.25℃) | 2250±750 |
Density(g/cm³.25℃) | 1.62±0.05 | 1.64±0.05 |
Mixing & Curing | Mix ratio(by weight) | A:B=1:1 |
Pot life 130±30g(min.25℃) | 45±15 |
Curing condition | Room temperature curing |
Surface drying time 30g(min.25℃) | 60-120min |
Curing time 30g(H.25℃) | 3-6H |
After curing | Color | Grey |
Hardness (Shore A) | 55±10A |
Temperature resistance(℃) | -60~200℃ |
Water absorption(24H) | ≤0.5% |
Surface resistivity(Ω/sq) | ≥1.0×1014 |
Volume resistivity(Ω.cm) | ≥1.0×1013 |
Elongation at break(%) | ≥60% |
Dielectric constant(at 50Hz) | ≤3.5 |
Breakdown voltage(kV/mm) | ≥20 |
Thermal conductivity(w/m.k) | ≥0.8 |
Flame retardancy UL94 | V2(6mm) |
Product Applications
- LED Power Supplies & Drivers: Encapsulates high-power LED drivers in streetlights, stadium
lights, and industrial lighting fixtures, efficiently dissipating
heat from power components to ensure stable performance and long
lifespan
- Industrial Control Systems: Protects PLC modules, motor controllers, and variable frequency
drives (VFDs) in manufacturing equipment, providing vibration
resistance and heat management for reliable operation in harsh
industrial environments
- New Energy Power Systems: Pottings power converters, battery management systems (BMS), and
charging modules in electric vehicles, solar inverters, and energy
storage systems, withstanding extreme temperature fluctuations and
ensuring electrical safety
- Telecommunications Infrastructure: Encapsulates power amplifiers, base station power supplies, and
signal processing modules in 5G communication systems, providing
efficient heat dissipation and protection against environmental
factors
Critical Curing & Handling Precautions
BZ-3903 utilizes an addition-cure mechanism that is sensitive to certain materials:
- Avoid Contamination: Prevent contact with organotin compounds, sulfur-containing
materials, and amine-containing substances during mixing and
dispensing, as these can inhibit curing
- Vacuum Degassing: For optimal results, degas the mixed adhesive under vacuum to
remove air bubbles, ensuring uniform potting and reliable
waterproof sealing
- Humidity Control: Maintain workshop humidity ≤70% during curing to prevent
moisture-related issues, especially in sealed assemblies
Directions for Use
- Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check
machine settings, check vacuum pump force, etc.
- Product Pre-treatment: Place product on a level surface or fixture. Remove dust,
clean, degrease, and dry if necessary.
- Accurate Proportioning: Manual operation requires precise mixing according to the
specified ratio and recording. Machine potting requires calibrated
ratios and first-article confirmation is recommended.
- Mixing & Stirring: Manual operation requires thorough stirring or using electric
stirrers to ensure homogeneous mixing. Machine potting requires
sufficient stirring speed, adjust as needed.
- Uniform Potting: Manual operation should be done in small, multiple batches to
ensure uniformity. Machine potting should follow the programmed
path for quantitative dispensing.
- Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble
removal, or secondary potting if required.
- Curing: Allow the potted and inspected products to cure at room temperature
or with heat assistance (recommended 60°C if needed), according to
product and process requirements.
- Final Product Confirmation: Perform visual inspection and performance testing as required by
the customer.
9. This series of products are room-temperature-curing,
addition-cure two-component silicone. During the dispensing
process, avoid contact with the following three types of materials
to prevent reactions that may affect the curing effect:
> a. >Organotin compounds and organotin-containing silicone rubber.
> b. >Sulfur, sulfides, and sulfur-containing materials.
> c. >Amine compounds and amine-containing materials.
10. It should be noted that during manual operation, when
vacuumizing the mixed A+B adhesive, the vacuum pressure must be
controlled to ensure the adhesive is not completely sucked out of
the container by the vacuum.
Packing & Shipping & Storage
- Part A: Typically supplied in 25kg sealed plastic drums.
- Part B: Typically supplied in 25kg sealed plastic drums.
- Store and transport as a general chemical product.
- Store sealed, protected from light at room temperature. Shelf life
varies from 6 to 12 months depending on packaging; please refer to
the expiry date on the shipping package.
- When temperature drops to 15°C or lower, the hardener or resin
should be stored in a warm place or heated before use for potting.
Specific heating recommendations depend on the temperature drop;
please communicate and consult with us.
FAQ:
Q1: What are the primary applications of High-Performance Silicone
Potting Compounds?
A1: High-Performance Silicone Potting Compounds are widely used for
protecting electronic components, sensors, and circuit boards from
moisture, dust, vibration, and thermal shock. They are ideal for
automotive, aerospace, and industrial electronics applications.
Q2: What temperature range can High-Performance Silicone Potting
Compounds withstand?
A2: These silicone potting compounds typically withstand a broad
temperature range, from approximately -60°C to +220°C, making them
suitable for extreme environmental conditions.
Q3: Are these silicone potting compounds electrically insulating?
A3: Yes, High-Performance Silicone Potting Compounds provide
excellent electrical insulation, helping to prevent short circuits
and ensuring reliable performance of electronic assemblies.
Q4: How is the curing process performed for these silicone potting
compounds?
A4: The curing process can vary depending on the specific
formulation but generally involves room temperature curing or heat
curing. They typically cure to a solid elastomer within hours to a
day, providing durable protection.
Q5: Are High-Performance Silicone Potting Compounds resistant to
chemicals and moisture?
A5: Yes, these compounds exhibit strong resistance to moisture,
water, and various chemicals, which helps enhance the longevity and
reliability of the encapsulated components.