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Beijing Hongkun Jiasheng Technology Co., Ltd.
Beijing Hongkun Jiasheng Technology Co., Ltd.
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Supermicro Server 3U Rackmount Microcloud Multi Node Cloud Computing

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Beijing Hongkun Jiasheng Technology Co., Ltd.

City: beijing

Province/State:beijing

Country/Region:china

Tel:86--13466633122

Contact Person:
Mr.Jeffrey
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Supermicro Server 3U Rackmount Microcloud Multi Node Cloud Computing

Processor Type IBM POWER9
Place of Origin US
Packaging Details Carton packaging
Security Features TPM 2.0, Secure Boot
Maximum Memory Capacity Up to 4TB
Model Number MicroCloud
Processor Support Intel Xeon / AMD EPYC
Memory Type DDR4 / DDR5 ECC Registered DIMMs
Delivery Time 5-7 work days
Raid Support Hardware RAID 0/1/5/10
Brand Name Supermicro
Supply Ability 200pcs
Management IPMI 2.0 with KVM over IP
Minimum Order Quantity 1pcs
Storage Options SATA / SAS / NVMe SSD/HDD
Price Negotiable
Detailed Product Description

Supermicro Server 3U Rackmount Microcloud Multi Node Cloud Computing

Product Description

The Supermicro MicroCloud family delivers ultra‑dense 3U rackmount servers with 5, 8, 10, or 12 independent hot‑swappable nodes — saving up to 76% rack space versus equivalent 1U servers. Each node operates independently with its own CPU, memory, storage, and networking, supporting AMD EPYC 4004/4005, Ryzen 7000/9000 (AM5), or Intel Xeon 2300 processors (up to 16 cores, 170W TDP). With front NVMe bays, PCIe 5.0 expansion, and single‑width GPU support (T4/L4/A2), the MicroCloud is purpose‑built for cloud, CDN, web hosting, virtualization, edge, and AI inference at scale.

Key Differentiators

  • 3.3× density of 1U servers: up to 12 independent nodes in 3U

  • Hot‑swappable nodes — service one without downtime to others

  • Per node: 4 x DDR5 DIMM slots, up to 192GB at 5600 MT/s

  • Per node: 2 x 3.5”/2.5” hot‑swap NVMe U.2/SAS/SATA bays + 1 x M.2 PCIe 5.0 NVMe

  • Per node: 1 x PCIe 5.0 x8 LP slot + 1 x Micro‑LP slot; supports single‑width GPU

  • Per node: 2 x 2.5GbE/10GbE RJ45 + optional 25/100GbE via Micro‑LP + dedicated BMC

  • Centralized IPMI 2.0, Redfish, KVM‑over‑LAN, TPM 2.0

  • Redundant Platinum/Titanium PSUs (96% efficiency)

Specifications

 
 
CategoryDetails
Form Factor3U rackmount, multi‑node
Node Configurations5N (GPU‑capable), 8N (standard), 10N (max CPU), 12N (legacy)
CPU (per node)Single socket: AMD AM5 or Intel Xeon 2300, up to 16 cores, 170W TDP
Memory (per node)4 x DDR5 DIMM slots, up to 192GB at 5600 MT/s
Front Storage (per node)2 x 3.5”/2.5” hot‑swap NVMe U.2/SAS/SATA
M.2 (per node)1 x PCIe 5.0 x4 NVMe (2280/22110, bootable)
PCIe (per node)1 x PCIe 5.0 x8 LP + 1 x Micro‑LP; supports 1 single‑width GPU
Networking (per node)2 x 2.5GbE/10GbE RJ45 + optional Micro‑LP (25/100GbE) + dedicated BMC
ManagementCentralized IPMI 2.0, Redfish, KVM‑over‑LAN, TPM 2.0
Power Supply2 x redundant Platinum/Titanium (96% efficiency)
Dimensions (WxHxD)447 x 130 x 711 mm (17.6 x 5.1 x 28 in)
Weight (net)~45 kg (99 lb)

Popular Models

  • AS‑3015MR‑H5TNR – 5‑node (CPU+GPU)

  • AS‑3015MR‑H8TNR – 8‑node (AMD EPYC/Ryzen)

  • AS‑3015MR‑H10TNR – 10‑node (max CPU density)

  • SYS‑5039MC‑H8TRF – 8‑node (Intel Xeon, DDR4)

Typical Configuration (per node)

  • CPU: 1 x AMD Ryzen 9 9950X (16 cores, 170W)

  • Memory: 128GB DDR5‑5600 (4 x 32GB)

  • Storage: 1 x 960GB M.2 NVMe + 2 x 3.84TB U.2 NVMe

  • Networking: 2 x 10GbE RJ45

Ordering Notes

  • Base SKU prefix: AS‑3015MR‑xxxx (AMD) / SYS‑5039MC‑xxxx (Intel)

  • Node suffix: H5TNR (5N), H8TNR (8N), H10TNR (10N)

  • Motherboard (per node): H13SRD‑F (AMD) / X11SCD‑F (Intel)

Product Tags: Cloud Computing Supermicro Server   Multi Node Supermicro Server   3U Rackmount microcloud server  
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