Basic Parameters | Screen Frame Size | 650(X)×420(Y)—850(X)×850(Y) (mm) |
Thickness:20-40mm |
Min PCB(mm) | 50(X)×50(Y) (mm) |
Max PCB(mm) | 510(X)×510(Y) (mm) |
Thickness | 0.2mm~6mm(Use jig when pcb less than 0.4mm) |
Curve | <1%(Diagonal measurement) |
PCB Backside Part Height | 20mm |
Conveyor Height | 900±40mm |
Support | Magnetic support, Magnetic piece, Vacuum chamber(Option) |
Clamp | Side clamp(Standard),please read the to option table |
Edge Distance | PCB process edge≥2.5mm |
Conveyor Speed | 0~1500mm/sec, increment 1mm |
Conveyor Belt | U type sync belt |
Stopper method | Air Cylinder |
Stopper position | Set the PCB stopper position according to the size of board |
Flow direction | L-R,R-L,L-L,R-R depends on customer |
Print System | Print Speed | 5-200mm/sec adjustable |
Print Head | Step motor drive scraper lifting |
Scraper | Steel scraper,rubber scraper(option) |
Scraper Angle | 60° |
Scraper Pressure | 0~20kg |
Vision System | Substrate Separation | Three-section Substrate Separation speed:0.1-20mm/s distance:0-20mm |
Alignment Position method | Mark automatic alignment |
Camera | Germany BASLER,1/3” CCD,640*480pixel, pixel size:5.6μmx5.6μm |
Acquire image method | Up/under double photo |
Camera Light | Coaxial light, Ring light four kinds light can adjustable |
View Range | 9mm*7mm |
Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% |
Mark Shape | Cir, Rec, or rhombus etc |
Mark Position | PCB dedicated mark or PCB pad |
2D detection | Standard |
Accuracy | Table Adjustment Range | X=±3mm,Y=±7mm, θ=±1.5° |
Positional Accuracy | ±0.01mm |
Printing Accuracy | ±0.025mm |
Time | Cycle Time | <10s (ex print, cleaning time) |
Convert line Time | <5min |
Programming Time | <10min |
Control System | Computer Configuration | Industrial PC,Windows official system |
System Language | Chinese,English |
Pre and next machine Connection | SMEMA |
User authorization | User PW and Senior PW set |
Cleaning System | Cleaning System | Dry and Wet(standard),vacuum model(option) |
Liquid Level Detection | Liquid level auto alarm detection |
Power Parameters | Main Power Supply | AC 220V±10% 50/60HZ Single phase |
Total Power | Approx.3kw |
Main Air Supply | 4.5~6kgf/cm2 |
Machine Weight | Approx.950Kg |
Machine Dimension | 1530(L)x1680(W)x1540(H)mm |
Option | Pneumatic Top Clamp | For PCB(thickness≤1mm) |
Top clamp + side clamp | For PCB(thickness≤1mm) |
Vacuum Adsorption and unloading | For PCB(thickness≤1mm) and FPC |
Auto tin added | / |
Auto Loading and Unloading | / |
Flexible and Universal Support | For the double-sided PCB (PCB backside parts Height ≤ 9mm) |
Automatic Positioning of screen frame | Automatic Positioning of screen frame |
PCB Thickness Auto Adjustment Function | Standard |
Squeegee Pressure Feedback Function | / |
Air conditioner | Customer can buy by themselves |
The rest of Solder Paste on the stencil Monitoring System | / |
SPI close loop | SPI close loop |
UPS power off protection | UPS 15min power off protection |
Industry 4.0 | Bar code trace function, production analysis etc |