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multilayer high density interconnect pcb
Selling leads
Product Description Application:communication Layer Count:20 Material:FR-4,IT180,TG180 Thickness:3.62mm Copper Thickness:1oz Dimension:428*233.1 ...
2025-07-13 00:22:06
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in ...
2025-07-13 00:22:05
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Product Description Layer Count:4 Material:FR4 TG150 Thickness:1.6mm Min.Hole Size:0.4mm,unaccept solder mask in vias Copper Thickness:Inner 1oz/Outer ...
2025-07-13 00:22:05
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