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Shenzhen Tecircuit Electronics Limited
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Multilayer Rigid Gold Finger PCB Printed Circuit Board for Memory Module

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Shenzhen Tecircuit Electronics Limited

City: shenzhen

Country/Region:china

Tel:86-0755-8487 -5025

Contact Person:
Mr.David Zeng View Contact Details

Multilayer Rigid Gold Finger PCB Printed Circuit Board for Memory Module
Brand Name TECircuit
Model Number TEC0157
Certification UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Place of Origin China
Minimum Order Quantity 1pcs for sample, 100pcs for bulk
Price USD 1.99 ~ USD9.99/pcs
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50000 pcs/month
Delivery Time 5-15 wotk days
Packaging Details Vacuum package+Carton box
Brand Shenzhen Tecircuit Electronics Co., Ltd
Product Type PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No. R0060
Service PCBA service
Detailed Product Description

Product Images

 

 

 

About TECircuit

 

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

 

Product Applications

 

  • DRAM Modules:

    • Used in Double Data Rate Synchronous Dynamic RAM (DDR SDRAM) modules, such as DDR4 and DDR5, to connect with the motherboard through gold fingers.

  • Graphics Memory Cards:

    • Employed in graphics cards to facilitate high-speed data transfer between the GPU and the memory.

  • Memory Expansion Cards:

    • Integrated into expansion cards that add additional memory capacity to systems, ensuring reliable connections.

  • Server Memory Modules:

    • Used in server-grade memory modules (e.g., ECC RAM) to enhance data integrity and performance in enterprise environments.

  • Embedded Memory Solutions:

    • Employed in embedded systems where memory modules need to connect securely and efficiently to processors.

  • Consumer Electronics:

    • Integrated into memory modules for devices like gaming consoles, tablets, and smartphones to improve performance.

  • High-Performance Computing:

    • Used in memory modules designed for workstations and HPC environments, where high bandwidth and low latency are critical.

  • Mobile Memory Modules:

    • Employed in mobile devices, ensuring compact and reliable memory connections in smartphones and tablets.

  • Data Center Applications:

    • Integrated into memory solutions for data centers, allowing for scalable and efficient memory configurations.

  • Testing and Prototyping:

    • Used in prototype memory modules for testing various configurations and designs in research and development.

 

Product Features 

  1. Gold Plating:

    • Gold fingers are plated to provide excellent electrical conductivity and resistance to corrosion, ensuring reliable connections.

  2. Durability:

    • The gold-plated contacts resist wear and oxidation, extending the lifespan of memory modules in high-use scenarios.

  3. High-Speed Performance:

    • Gold fingers support high-speed data transmission, which is crucial for the performance of memory modules.

  4. Signal Integrity:

    • The smooth surface of gold connectors minimizes signal loss and interference, ensuring stable operation.

  5. Compatibility:

    • Designed to work with standard memory slots and connectors, facilitating easy integration with motherboards and systems.

  6. Cost-Effectiveness:

    • While gold plating incurs additional costs, it reduces maintenance needs and enhances overall performance over time.

  7. Customization:

    • Gold finger PCBs can be tailored to specific memory module designs and configurations, allowing for unique implementations.

  8. Ease of Assembly:

    • Gold fingers simplify the assembly and disassembly of memory modules, making upgrades and repairs more straightforward.

  9. Thermal Management:

    • Good electrical connections facilitate better thermal performance, helping to dissipate heat generated during operation.

  10. Regulatory Compliance:

    • Designed to meet relevant industry standards for safety and performance, ensuring dependable operation in various applications.

 

 

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers:1-42layers
PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:620mm*1100mm
PCB certificate:RoHS Directive-Compliant
PCB Thickness:1.6 ±0.1mm
Out Layer Copper Thickness:0.5-5oz
Inner Layer Copper Thickness:0.5-4oz
PCB max. board thickness:6.0mm
Minimum Hole Size:0.20mm
Minimum Line Width/Space:3/3mil
Min. S/M Pitch:0.1mm(4mil)
Plate Thickness and Aperture Ratio :30:1
Minimum Hole Copper:20µm
Hole Dia. Tolerance(PTH):±0.075mm(3mil)
Hole dia. Tolerance(NPTH):±0.05mm (2mil)
Hole Position Deviation:±0.05mm (2mil)
Outline Tolerance:±0.05mm (2mil)
PCB solder mask:Black, white, yellow
PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:White
E-test:100% AOI, X-ray, Flying probe test.
Outline:Rout and Score/V-cut
Inspection Standard:IPC-A-610CCLASSII
Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
Product Tags: Multilayer Rigid Gold Finger PCB   Rigid Gold Finger PCB Board   Memory Module Gold Finger PCB  
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