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epoxy curing agent
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DMP-30 is mainly used as an epoxy resin curing agent. DMP-30 provides fast cure in ordinary temperature of cure epoxy resin paint in low temperature. ...
2026-06-20 00:27:47
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Product Details Application: COATINGS AND FLOORINGS AHEW (g/ml): 0.9816 Recommended Using Level: 7-15 Boiling Point: >260°C Amine Value: 320-360 (mg ...
2026-06-20 00:27:47
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Low-Viscosity Modified Cycloaliphatic Amine Curing Agent Ancamine 2280 1, General Description: Ancamine 2280 curing agent is a low-viscosity modified ...
2026-06-20 00:27:47
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Low Volatile Solvent Free Accelerated Polyamide Adduct Ancamide 2050 1, General Description: Ancamide 2050 is an accelerated polyamide adduct designed ...
2026-06-20 00:27:47
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Product Details Storage Temperature: 0-35°C Application: COATINGS AND FLOORINGS Form: Clear Liquid Colour: 3 Boiling Point: >260°C Solid Content (%): ...
2026-06-20 00:27:47
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Product Details Storage Temperature: 0-35°C Solid Content (%): 100 Application: COATINGS AND FLOORINGS Colour: 3 Boiling Point: >260°C Form: Clear ...
2026-06-20 00:27:47
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Medium And Low Viscosity Modified Polyamide Epoxy Curing Agent Hardener D140 1, General Description Polyamide D140 is a reactive polyamide with medium ...
2026-06-20 00:27:47
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Epoxy Systems Novel Waterborne Curing Agent ANQUAWHITE 100 1, General Description: ANQUAWHITE 100 curing agent is a novel waterborne curing agent ...
2026-06-20 00:27:47
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Standard Liquid Epoxy Resin Waterborne Curing Agent ANQUAMINE 721 1, General Description: ANQUAMINE 721 is a waterborne curing agent for use with ...
2026-06-20 00:27:47
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High Molecular Weight Polyamide Resin Epoxy Curing Agent SUNMIDE 353N Overview 1, General Description: SUNMIDE 353N curing agent is a Fast dry. Good ...
2026-06-20 00:27:47
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