561 - 570 of 856 Selling leads
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Bead Polymer Butyl Binder Granulated Polymer DEGALAN LP 64/12 1, General Description DEGALAN LP 64/12 is a granulated polymer . It is versatile binder ...
2026-06-22 00:11:58
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Product Details Application: COATINGS AND FLOORINGS AHEW (g/ml): 0.9816 Recommended Using Level: 7-15 Boiling Point: >260°C Amine Value: 320-360 (mg ...
2026-06-22 00:11:58
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Low-Viscosity Modified Cycloaliphatic Amine Curing Agent Ancamine 2280 1, General Description: Ancamine 2280 curing agent is a low-viscosity modified ...
2026-06-22 00:11:58
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Low Volatile Solvent Free Accelerated Polyamide Adduct Ancamide 2050 1, General Description: Ancamide 2050 is an accelerated polyamide adduct designed ...
2026-06-22 00:11:58
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Product Details Storage Temperature: 0-35°C Application: COATINGS AND FLOORINGS Form: Clear Liquid Colour: 3 Boiling Point: >260°C Solid Content (%): ...
2026-06-22 00:11:58
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Product Details Storage Temperature: 0-35°C Solid Content (%): 100 Application: COATINGS AND FLOORINGS Colour: 3 Boiling Point: >260°C Form: Clear ...
2026-06-22 00:11:58
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Medium And Low Viscosity Modified Polyamide Epoxy Curing Agent Hardener D140 1, General Description Polyamide D140 is a reactive polyamide with medium ...
2026-06-22 00:11:58
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Epoxy Systems Novel Waterborne Curing Agent ANQUAWHITE 100 1, General Description: ANQUAWHITE 100 curing agent is a novel waterborne curing agent ...
2026-06-22 00:11:58
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Standard Liquid Epoxy Resin Waterborne Curing Agent ANQUAMINE 721 1, General Description: ANQUAMINE 721 is a waterborne curing agent for use with ...
2026-06-22 00:11:58
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High Molecular Weight Polyamide Resin Epoxy Curing Agent SUNMIDE 353N Overview 1, General Description: SUNMIDE 353N curing agent is a Fast dry. Good ...
2026-06-22 00:11:58
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