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Shenzhen Hongxinteng Technology Co., Ltd.
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Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

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Shenzhen Hongxinteng Technology Co., Ltd.

City: shenzhen

Country/Region:china

Tel:+86-16620793861

Contact Person:
Miss.Alina View Contact Details

Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine

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Brand Name GKG
Model Number GD602D
Certification CE
Place of Origin China
Minimum Order Quantity 1
Price 26000
Payment Terms T/T
Supply Ability The production capacity is 30 units a month
Delivery Time 20-25
Packaging Details Vacuum packing plus wooden box packing
Application COB flexible Strip light
Name Flip Chip Die Bonder
Maximum board size 152MMX152MM
Condition Original new
Usage SMD LED SMT
core components PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump
Brand GKG
Detailed Product Description

Fully Automatic Smt Production Line Flip Chip Die Bonder Machine For COB Strip Light and Semiconductor Packaging Chip Mounting Electronics Machinery 


High-Speed ​​Flexible Strip Die Bonder

Product Features
1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding.

2. Compatible with a printer to enable a variety of in-line process solutions.

3. Fully integrated carrier from loading, printing, to die bonding and placement.

4. The carrier supports 0.5M materials, and mid-process transfers are accomplished using a docking station.

5. Equipped with a variety of practical features, including automatic calibration, automatic die ring changer, and a feeder-style quick-release workbench.


Product specification

Speed of die attach≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements) 
Position accuracy of die attach± 1 mil (± 25um) 
Angle accuracy of wafer± 1 ° 
Crystal loss detection functionWith (vacuum detection mode) 
Solid leakage detection functionWith (vacuum detection mode) 
Capacity statistics functionYes
Statistical function of consumables usageYes
Function of parameter modification recordYes
User privilege management functionYes
Module of wafer worktable
Size of the chip3milx5mil-60mlx60mil
Thickness of the wafer0.1-0.7 mm
Maximum correction angle of wafer± 15 ° 
Maximum size of wafer and wafer ring6“Crystal Ring (152 mm outer diameter) .”
Maximum area size of wafer4.7“(119 mm) 
Maximum travel of worktable152MMX152MM
XY resolution0.5 um
Thimble height travel in z direction3 mm
Thimble capSingle Needle (with) 
Motor and drive systemHome-made linear motor & Huichuan District Drive
Image recognition system
Methods of image recognition256 grayscale
Image resolution720 * 540
Accuracy of image recognition± 0.025 Mil@50 Mil observed range
Foolproof function of chipYes
Pre-consolidation testing functionYes
Post-consolidation image detection functionYes
Mode of feedingAutomatic connection of incoming and outgoing materials
Solid Crystal Swing Arm System
The way of fixing crystalDouble Swing Arm 180 ° rotation solidification
Suction pressure of crystal30g-250g adjustable
Manual adjustment of suction nozzle vacuum sensitivityYes
Module of substrate workbench
Mounting speed5000-6000UPH
Range of travel of worktable140mmx620mm
Adapt to the width of the substrate60-120mm
Adapt to the length of the substrate100-600mm
Thickness of substrate0.1-2mm
XY resolution0.5um
Motor and drive systemHome-made Linear Motor & Huichuan District Drive
Fixing method of base plateManipulator plus vacuum suction platform



Applications:

Product application
COB flexible lamps are mainly used in smart home, intelligent lighting, car decoration, intelligent decoration and other applications.

Applicable products: Flexible Lamp Belt (FPC, PCB, BT) , SMD, resistors, IC components and other flip-chip products solid crystal.
Product Tags: fully automatic flip chip die bonder   transistor die bonding machine   semiconductor die bonder machine  
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