Lead-Free JT Reflow Oven JTR-1200 Soldering Machine SMT Hot Air HXT Reflow Oven SMD Welding Equipment For PCB Soldring Manufacturing

Product introduction

Multi-layer insulation furnace design, furnace shell surface temperature reduced by 10 degrees to 20 degrees, effectively reduce the working environment temperature.
15% improvement in heat transfer efficiency to meet the lead-free process requirements of more complex and larger soldering products.
Strengthen the main crane arm to ensure that the guide rail without lateral deformation, to prevent the occurrence of card plate and plate drop phenomenon.
Full protection of the use of closed furnace design, effective protection of nitrogen is not easy to run off, so that the minimum oxygen content can be up to 150 ppm.
Low nitrogen consumption, only 20-22 m3/h at 300-800 ppm oxygen concentration.
95% of the material in the machine can be recycled.
The new cooling structure allows most of the exhaust gas to return to the furnace after filtration or recovery, reducing heat loss and enabling more thorough flux recovery.
The double guide rail structure can effectively improve the production efficiency, save energy consumption and production cost.
The surface temperature of the working furnace body is low, and the heat loss is very small.

Product Specification

Applications:

Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.