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Shenzhen Hansion Technology Co., Ltd.
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Customization Multilayer PCB Circuit Board HDI And High Density Interconnects

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Shenzhen Hansion Technology Co., Ltd.

City: dongguan

Country/Region:china

Tel:86-0769-81605596

Contact Person:
Mr.Hank xiong
View Contact Details

Customization Multilayer PCB Circuit Board HDI And High Density Interconnects

Brand Name Hansion
Model Number FR4 double side PCBA
Place of Origin China
Minimum Order Quantity 1
Price 5
Payment Terms Western Union,T/T
Supply Ability 10000PCS per month
Delivery Time 3-5days
Packaging Details foam+custom box
Silkscreen Color White, Black, Yellow
Material FR4
Minimum Trace/Space 4/4 mil
Copper Thickness 1/2 oz, 1 oz, 2 oz
Surface Finish HASL, ENIG, OSP, Immersion Silver, Immersion Tin
Layer 2-16 layers
Minimum Hole Size 0.2 mm
Solder Mask Color Green, Blue, Black, Red, Yellow, White
product name HS-FR4 PCBA 001
Detailed Product Description
Description
Technology & Capabilities
1. Product Range
Rigid PCBs from 2- 24 layers, HDI; Aluminium base
2. Min. Board Thickness
2 layer
4 layer
6 layer
8 layer
10 layer
min. 0.2 mm
0.4 mm
1 mm
1.2 mm
1.5 mm
12 & 14 layer
16 layer
18 layer
20 layer
22 & 24 layer
1.6 mm
1.7 mm
1.8 mm
2.2 mm
2.6 mm
3. Max. Board Size
610 x 1200 mm
4. Base Material
FR-4 Glass Epoxy laminate, Aluminium base, RCC
5. Surface Finish Treatment
Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic)
6. Major Laminate
King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others.
7. Via Holes
Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH
8. Copper Foil Thickness
18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz)
18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz)
9. Min. Via Size and Type
Dia. 0.15mm (Finished).
Aspect Ratiao = 12; HDI holes (<0.10mm)
10. Min. Line Width & Spacing
0.75 mm/ 0.10mm ( 3mil/ 4mil)
11. Min Via Hole Size & Pad
Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via
12. Impedance I Control Tol.
+/- 10% ( min. +/- 7 Ohm)
13. Solder Mask
Liquid Photo- Image (LPI)
14.  Profiling
CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering
15.  Capacity
100 k㎡ output monthly

 

 

FAQ:

Question 1.Are you pcba factory?

Answer:yes of course.

Question 2:Does your factory provide one stop service?

Answer:Yes of course we have purchase department and designer.

Question 4:can you provide me sample to test before mass order?

Answer:Yes of course

Question 5:how about your package?are you sure that i will receive the prefect goods without damage?

Answer:we provide custom foam box to protect the product.

 

 

Product Tags: Customization Multilayer PCB Circuit Board   High Density Interconnects PCB Circuit Board   Customization multilayer pcb fabrication  
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