Precision Cleaning Expert: Redefining Micro-Nano Level Cleanliness
Standards
Using 80kHz±0.1% ultra-high frequency precise control, it generates
nanoscale cavitation bubbles with a diameter <50μm and an impact
force of 30MPa, specifically designed for microstructures below
0.1mm:
- MEMS Sensor Cleaning: Capable of removing 0.5μm-level silicon powder particles with a
residue rate <0.05 particles/mm² (superior to JEDEC J-STD-001
standards);
- PCB Pad Degumming: Through 10ms pulsed power output (50-200W), it avoids pad
corrosion caused by traditional solvent cleaning, reducing
soldering defect rates from 0.8% to 0.1%.
- Power Ramping Protection: 0-100% power ramp-up time ≤15s, combined with constant amplitude
control technology (fluctuation ≤±1%). When cleaning 3D-printed
precision gears, the tooth surface roughness Ra value remains
unchanged (original Ra0.4μm);
- Temperature Control Precision: The heating module uses a PID algorithm with temperature
fluctuations of ±1°C, avoiding coating stress damage caused by
temperature differences during optical lens cleaning, increasing
the yield rate to 99.5%.
3L/6L capacity models are only A4-sized (dimensions 300×200×150mm)
and support plug-and-play:
- Special for Digital Maintenance: Cleans residual flux from mobile phone motherboard solder joints
within 5 minutes. With ultrasonic-specific cleaning agents, ion
contamination <1.5μg/cm² (compliant with IPC-TM-650 standards);
- Watch Maintenance Magic Tool: 40kHz frequency + 100W power removes sweat stains from watch
strap gaps in 3 minutes, restoring stainless steel case gloss to
over 98%.
