Jietai Ultrasonic/Fully Automatic Ultrasonic Cleaning Machine For
Semiconductor Wafers - Five-stage cleaning process to overcome the challenges of cleaning
complex curved surfaces
A customized five-stage cleaning process of ultrasonic rough
cleaning → high-pressure spraying → fine brushing with brushes →
ultrasonic rinsing → hot air drying is designed to address the
three major pollution sources of camera frames (aluminum
alloy/stainless steel/ceramic materials), namely CNC machining
residues, electroplating oil stains, and fingerprint and sweat
stains:
- Dual-frequency ultrasonic collaboration: The 28kHz low-frequency
ultrasonic (15kW) breaks up hard particles remaining from CNC
cutting fluid, while the 40kHz high-frequency ultrasonic (10kW)
removes 0.1μm-level oil stains on the electroplated layer surface.
The measured cleanliness rate of the inner wall of blind holes
reaches 99.2%.
- Bionic brush system: Nylon bristle brushes with a diameter of
0.05mm (Shore hardness 50°) are used, combined with a ±1mm
profile-following floating mechanism. This ensures a perfect fit to
the R corners (minimum R0.3mm) of the frame and the coated surface,
achieving zero scratches during the cleaning process (surface
roughness Ra≤0.2μm).
- Full-automatic intelligent control, increasing the yield rate by
30%
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