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thermal conductive paste for electronics
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Product Introduction hin-Etsu MicroSi’s X-23-7868-2D thermal interface material is an ideal choice for high-performance platforms. Its excellent ...
2026-07-28 18:00:13
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DOWSIL™ CN-8880 Non-Curing Thermal Grease for Heat Sink Gap Filling Basic Product Properties DOWSIL™ CN-8880 is a non-curing, thermally conductive ...
2026-07-28 18:00:13
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... compound based on a polydimethylsiloxane matrix with thermally conductive fillers. It has a viscosity of 100,000 cP, a specific gravity of 3.5, ...
2026-07-28 18:00:13
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... Attributes Dowsil TC-5888 is a gray, thixotropic, non-curing thermally conductive compound designed to facilitate efficient heat transfer in ...
2026-07-28 18:00:13
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.... This gray elastomer offers a low viscosity formulation, easy mixing, and room temperature curing, making it suitable for a wide range of ...
2026-07-28 18:00:13
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..., which is a type of thermal interface material (TIM). It is designed to fill air gaps between heat-generating components and heat sinks, thereby ...
2026-07-28 18:00:13
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...Thermal Grease for Electronics Thermal Management Product Properties DOWSIL™ TC-5628 is a one-part, blue, thermally conductive grease. It features ...
2026-07-28 18:00:13
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...Electronics Heat Sink Bonding Thermal Conductive Adhesive Basic Properties Shin-Etsu KE-4901 is a one-component, white, thixotropic silicone ...
2026-07-28 18:00:13
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...thermally conductive compound developed by Dow Corning. It is designed to provide efficient thermal management for electronic devices by ensuring ...
2026-07-28 18:00:13
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...thermally conductive silicone gap filler designed for efficient heat dissipation in electronic devices and electric vehicle (EV) modules. With a ...
2026-07-28 18:00:13
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