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electrolube fthc thermal paste
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Product Description Shin-Etsu KS-609 thermal interface grease is a specially designed high thermal conductivity product suitable for electronic ...
2026-07-28 18:00:13
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...Thermal Grease for High-Performance Processors Product Introduction: Shin-Etsu X-23-7921-5 Thermal Grease Basic Properties Shin-Etsu X-23-7921-5 is ...
2026-07-28 18:00:13
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DOWSIL™ CN-8880 Non-Curing Thermal Grease for Heat Sink Gap Filling Basic Product Properties DOWSIL™ CN-8880 is a non-curing, thermally conductive ...
2026-07-28 18:00:13
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...paste Specific Gravity 2.8 Viscosity @23°C (Pa·s) 110 Thermal Conductivity (W/m·K) 2.0 Dielectric Strength (kV/0.25mm) 5.0 Volatile Siloxane (ppm) ...
2026-07-28 18:00:13
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Product Attributes Dowsil TC-5888 is a gray, thixotropic, non-curing thermally conductive compound designed to facilitate efficient heat transfer in ...
2026-07-28 18:00:13
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Product Introduction of Shin-Etsu KS-612S Product Simple Attributes Shin-Etsu KS-612S is a high-performance silicone material with excellent ...
2026-07-28 18:00:13
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... stability. Formulated with a blend of polydimethylsiloxane fluid and inert amorphous silica filler, it appears as a white translucent paste. ...
2026-07-28 18:00:13
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...paste like Thermal conductivity: 2.9 W/m · K (high thermal conductivity) Thermal resistance: 0.03 ℃ · cm ²/W (under 40 psi pressure) Curing ...
2026-07-28 18:00:13
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... - Non-flowable paste Tack-free time 23°C 10 min Cured Properties 7 days @ 23°C, 50% RH Hardness (Type A) - 28 Tensile Strength - 1.9 MPa ...
2026-07-28 18:00:13
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... – Non-flowable paste Tack-free time 23°C, min 10 Cured Properties 7 days @ 23°C, 50% RH Density g/cm³ 1.04 Hardness Type A 28 Tensile Strength ...
2026-07-28 18:00:13
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