High Precision Fully Automatic Powerful Dicing System for SMT Assembly Line
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Detailed Product Description
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High Precision Fully Automatic Powerful Dicing System for SMT
Assembly Line The dicing system utilizes a specialized slim blade mounted on the
spindle head to perform precision cutting operations. Through
high-speed spindle rotation, it accurately cuts materials including
glass, ceramic, semiconductor chips, PCB boards, EMC wire frames,
and various other substrates. Operation Procedures Wafer or Strip Tape Mounting Dicing Cleaning UV Separation Automated Dicing System Description The auto-dicing system performs complete automated operations
through a comprehensive process sequence including feeding,
position calibration, cutting, cleaning/drying, and unloading. Feeding Automatically Position Alignment Auto-Dicing Cleaning/Drying Unloading Automatically
Applications The automatic dicing system is widely used for precision cutting of
semiconductor chips, LED chips, EMC lead frames, PCB boards, IR
filters, sapphire glass, and ceramic thin plates. Ceramic Substrate Silicon Rubber Lead Frame Silicon Wafer PCB Glass Operating Requirements
Full Auto Dicing System YS-2000AD Product Features
Process Description
Case Sharing Optional Equipment
Platform Capacity Comparison Standard 8-inch Platform Capacity: 2 pieces of material SDS1000/ADS2000 with 12-inch Chuck Capacity: 4 pieces of material per cycle Efficiency Benefits
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| Product Tags: fully automatic PCB depaneling machine high precision SMT dicing system powerful SMT assembly line cutter |
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