High Precision CCD Automatic Positioning Online PCB Router Machine
Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards
450×430 mm 15W UV PCB Separator / FR4 Board Laser Depaneling
Machine with ±20 μm Precision
Advanced Laser Depaneling Technology
- Completely software-controlled laser process with adaptable
processing parameters and laser paths for varying materials and
cutting contours
- UV laser cutting eliminates appreciable mechanical or thermal
stresses on components
- Minimal cutting channel requirement (few µm) enables higher
component density on panels
- Dual-mode system software separates production and setup processes
to reduce operator errors
- Integrated vision system with fiducial recognition operates 100%
faster than previous versions
YASTM-4C Laser Depanelizer Machine Features
- High Precision Positioning: CCD automatic positioning with automatic focusing for fast,
accurate operation
- User-Friendly Design: Simple interface, easy operation, compact footprint, and rigorous
security design
- Energy Efficient: Reduced energy consumption for significant cost savings
- High Performance: Cost-effective solution with fast cutting speed and stable
performance
YASTM-4C Technical Specifications
| Parameter | Specification |
|---|
| Technical Parameters | Main body of laser: 1480mm × 1360mm × 1412mm |
| Power | AC220 V |
| Laser Type | 355 nm |
| Laser Source | Optowave 10W (US) |
| Material Thickness | ≤1.2 mm |
| Precision | ±20 μm |
| Platform Precision | ±2 μm |
| Working Area | 600 × 450 mm |
| Maximum Power | 3 KW |
| Vibration Control | CTI (US) |
| Beam Diameter | 20±5 μm |
| Ambient Temperature | 20±2 ℃ |
| Machine Base | Marble |
