China PCB Depaneling Machine manufacturer
YUSH Electronic Technology Co.,Ltd
YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.
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High Efficiency X-Ray Solution YS-X6600,Microfocus X-Ray Inspection System Manufacturer

High Efficiency X-Ray Solution YS-X6600,Microfocus X-Ray Inspection System Manufacturer

Brand Name YUSH
Model Number YS-X6600
Place of Origin GuangDong
Minimum Order Quantity 1
Price USD38650
Payment Terms L/C, D/A, D/P, T/T, Western Union
Supply Ability 100
Delivery Time 20work days
weight 1170kg
Model YS-X6600
Standard size 540mm*450mm
Total power 1700W
Detailed Product Description

1.Application

1: Semiconductor2: Automotive electronics3: PCB’A4: LED
5: BGA/QFN inspection6: Aluminum die casting7: Mould8: Electrical and mechanical components
9: Biological agriculture seed10: Aviation component11: Wheel hub12: Wire/USB/Plug

 

2.Functions and Features

FunctionAdvantages
X-ray tube and detector can move along Z direction, Speed of table moving along X-Y direction can be adjusted.Larger effective detection range, improving the magnification and the detection efficiency of the product.
High-definition digital flat panel detector. Max Inclined Angle is 60°, samples can be observed with a unique perspective.Easy to identify the side defects of the product and achieve no dead angle detection.
Long life X-ray tube, maintenance free for life.Adopt the world's top Japanese Hamamatsu X-ray source
Fault less than 2.5μm can be detected. High detection repeat accuracy.Easy to distinguish the gold wire bending and break of the semiconductor package.
Powerful CNC Measuring Function, can test automatically, testing program can be edited.Suitable for large-scale inspection and improve detection efficiency.
Large inspection space, can put various large-sized samples. The table can carry 10KG items.Large table for large industrial control boards, ultra-long LED strips, and electronic products for various fields
Large navigation view, table will move to where you click the mouse.Very easy to operate, quickly find item defects and improve detection efficiency

 

3.Hardware Technical Parameters

Tube typeSealed microfocus X-ray tube
Tube voltageTube voltage
Tube current10-200uA (software limited to 89uA )
Focal spot size5-15μm
Cooling methodConvection cooling
Detector typeHD digital flat panel detector (FPD)
Imaging area130mm*130mm
Pixel matrix1536*1536 pixels
Inclined Angle0-60°
Repeated test accuracy3μm
Software inspection speed3.0s/point (Excluding loading and unloading time)
Standard size540mm*450mm
Effective inspection area500mm×420mm
Load capacity≤5Kg
Operating platformMouse, keyboard, 2 operating modes
Inner lead plate5 mm thick lead plate (isolate radiation)
Dimensions1245mm(L) * 1230mm(W) * 1900mm(H)
Weight1170Kg
Power supplyAC 110-220V (+10%)(international general power supply)

 

4.Software technical parameters

BGA shortPreset NG images, software contrasts and recognizes automatically
BGA false solderPreset NG images, software contrasts and recognizes automatically
Area measurementPreset area size standard, NG product prompt function.
Size measurementDistance, gold line curvature, slope, angle, etc.
Automatic positioningPower on table auto zero function, system reset
Control modeCNC Automatic control, manual control keyboard, mouse, 3 modes are optional.

 

5.Table Control

1. Speed of table can be adjusted by the spacebar: low, normal and high speed.

2. X, Y, Z three-axis motion and inclined angle are controlled by keyboard.

3. Large navigator view, clear navigation image, table will move to where you click the mouse.

 

6.CNC Programming

1. Simply click the mouse and you can write programs.

2. Object table moves along X, Y direction for positioning; X-ray tube and detector move along Z direction for positioning.

3. Voltage and current set by software.

4. Image settings: brightness, contrast, auto gain and exposure

5. Users can change the pause time for program conversion.

6. Anti-collision system can maximize the tilt and observation of the workpieces.

7. Automatic analysis on diameter, proportion of cavity, area and roundness of BGA.

 

7.X-Ray Working Principle

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