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thermally conductive engineering resin foam material
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Blue Soft Thermal Gap Filler 1.5w / Mk For Automotive Engine Control Units UL RoHs The TIF™100 Series thermally conductive interface materials are ...
2024-12-09 11:03:26
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yellow Automotive Engine Control Units Thermal Gap Filler Replace Bergquist Gap Pad TIF400 The TIF™400 Series thermally conductive interface materials ...
2025-07-30 00:03:26
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... thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, ...
2024-12-09 17:52:10
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CPU Silicone Rubber Thermal Gap Pad TIF540US 2.95 g/cc Cooling High Adhesive 2.6W/mK for Automotive engine control units The TIF™540US Series ...
2025-07-30 00:03:26
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2.6 W/m-K Silicone Rubber Thermal Gap Pad For Automotive Engine Control Units 18 Shore 00 ultra soft TIF™560US The TIF™560US Series thermally ...
2025-07-30 00:03:26
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3.5mm 94 V0 new developed Silicon Thermal Gap Pad for Automotive engine control units 2.6w TIF™5140US China supplied The TIF™5140US Series thermally ...
2025-07-30 00:03:26
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...material rated at a thermal conductivity of 5.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. ...
2025-07-30 00:03:26
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