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server heat dissipation pcm
Selling leads
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Calculator Server Heat Dissipation Phase Change Material PCM TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800A-AL ...
2025-07-25 00:03:49
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... are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, ...
2025-07-25 00:03:49
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...Heat Dissipation TIG780-25 Series Datasheet-(E)-REV01.pdf The TIG™780-25 products are the high-efficiency heat dissipation ones for the fillings ...
2025-07-25 00:03:49
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...Heat Dissipation 1.5 W/mK RoHS compliant TIF100-05E 35 Shore 00 The TIF100-05E Series thermally conductive interface materials are applied to fill ...
2025-07-25 00:03:49
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...fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited ...
2025-07-25 00:03:49
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... the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to ...
2025-07-25 00:03:49
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...Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK The TIF100-30-05S thermally conductive ...
2025-07-25 00:03:49
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...Heat Dissipation Product introduction The TIF180-20-50E Series thermally conductive interface materials are applied to fill the air gaps between ...
2025-07-25 00:03:49
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...Heat Dissipation 3.0 W/mK RoHS compliant TIF500-30-11US 25 Shore 00 The TIF500-30-11US Series thermally conductive interface materials are applied ...
2025-07-25 00:03:49
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...fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited ...
2025-07-25 00:03:49
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