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cpu silicon thermal pad
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20 shore00 Easy release construction heat sink pad 1.8W/mK, 2.5mmT for Automotive electronics The TIF5100-18-11US is not only designed to take ...
2025-07-27 00:03:54
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1.8W/mK 20 shore00 Moldability for complex parts heat sink pad ,3.0mmT for Memory Modules The TIF5120-18-11US is not only designed to take advantage ...
2025-07-27 00:03:54
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5W / MK, China company supplied heat sink pad 45 shore00 with grey colour For LED TV and LED-lit lamps The TIF5160-50-11US is recommended for ...
2025-07-27 00:03:54
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...Thermal Interface Pad Low Resistance -25℃ - 125℃ The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series ...
2025-07-27 00:03:53
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...Thermal Resistance 1.6W/mK Phase Change sheet For Electronic Components The TIC80OK Series products is a high thermal conduction and dielectric ...
2025-07-27 00:03:53
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...Thermal Conductive PCM Phase Change Materials For Telecommunication Hardware The TIC™800P-K1 Series product is a high thermal conductivity and ...
2025-07-27 00:03:53
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4.0mmT Naturally tacky needing no further adhesive coating for DVD-Rom cooling The TIF1160-32-05US is not only designed to take advantage of the gap ...
2025-07-27 00:03:54
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Manufacturer Supplier Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad The TIF™100-66U series thermally conductive interface materials are ...
2025-07-27 00:03:54
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