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Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive

Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive

Brand Name Ziitek
Model Number TIE™ 280-12AB
Certification RoHs
Place of Origin China
Minimum Order Quantity 2kg/LOT
Supply Ability 1000KG
Delivery Time 2-3 work day
Packaging Details 1kg/can
keywords Thermal Conductive Glue
Hardness @25℃ 85 Shore D
Service temperature -40℃ to 160℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Thermal Conductivity 1.2W/m-K
Dielectric Strength 300 volts / mil
Detailed Product Description

Thermal Conductive Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes​

 

 

TIE™ 280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

 

TIE280-12AB-Series-Datasheet (1).pdf

 

 

 Features     

      

> Good thermal conductive: 1.2W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof. 

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

 

 Application

 

> Automotive starters potting; General potting Thermal detector potting

> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

> Power transformers and coils; Potting capacitors Potting of small electrical devices

> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

> Optical / medical component adhesive

 

Typical Properties of TIE280-12AB Series
Typical Uncured Material
TIETM280-12A(Resin)Mixing ratio (weight ratio)
A:=1 :1
ColorBlack
Viscosity @25℃ Brookfield15000 cPsViscosity @25℃ Brookfield10000 cPs
Operating time (@25℃)45 mins
Shelf life @25℃ in sealed12 monthsspecific Gravity1.6 g/cc
Mixture ColorBlack
TIE280-12B(Hardener)Cure Schedule
ColorBlackCure at 25C3 hrs
Viscosity @25℃ Brookfield7000 cPs
Shelf life @25℃ in sealed container12 monthsCure at 7o°c30 mins
Cured Properties
Hardness @25℃85 Shore D
Operating temperature-40℃ ~160℃
Glass transition temperature Tg92℃
Rate of tension0.10%
Coefficient of thermal expansion, /℃3.0x 10^(-5)
Fire resistance uL94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃<0.1%
Thermal Conductivity1.2 W/m-K
Dielectric Breakdown Voltage300 volts / mil
Dielectric Constant@1MHz4.2
volume resistivity, ohm-cm @ 25℃3.0x 10^13

 

Product packaging

 

1KG A/B for each tank.

5KG A/B each.

10KG A/B each.

 

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Product Tags: High Thermal Conductive Glue   Electronic Epoxy Resin Adhesive   Potting Epoxy Resin Adhesive  
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