PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for
FR4 PCB Boards Laser PCB Separator Advantages
- The laser process is completely software-controlled. Varying
materials or cutting contours are easily taken into account through
adapting the processing parameters and laser paths.
- In the case of laser cutting with the UV laser, no appreciable
mechanical or thermal stresses occur.
- The laser beam merely requires a few µm as a cutting channel. More
components can thus be placed on a panel.
- The system software differentiates between operation in production
and setting up processes. That clearly reduces instances of faulty
operation.
- The fiducial recognition by the integrated vision system is done in
the latest version around 100% faster than before.
Laser PCB Separator Machine Principle
Laser PCB Separator Parameter
| Parameter | |
Technical parameters | Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of machine | 1500Kg |
| Power | AC220 V |
| Laser | 355 nm |
| Laser | Optowave 10W(US) |
| Material | ≤1.2 mm |
| Precisio | ±20 μm |
| Platfor | ±2 μm |
| Platform | ±2 μm |
| Working area | 450*430 mm |
| Maximum | 3 KW |
| Vibrating | CTI(US) |
| Power | AC220 V |
| Diameter | 20±5 μm |
| Ambient | 20±2 ℃ |
| Ambient | ＜60 % |
| The Machine | Marble |
Laser PCB Separator Features
1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time
3. High quality ,no distortion,surface clean& uniformity
4. Gathering the CNC tech,laser tech,software tech…High
accuracy,High speed.
Product Photos
Our Service
# 1 day delivery
# 24 hours fast response
# Largest manufactory in South China
# 100% responsible for quality
# 14 years experience
# 1 year warranty
