Leadless Chip Thermometrics NTC Thermistor , SMD / Surface Mount Thermistor
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Leadless Chip Thermometrics NTC Thermistor , SMD / Surface Mount Thermistor
SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Feature
Lead(pb)freeproduct.Wide operating temperature:﹣40℃ to﹢125℃.
SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Applications
SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics
Thermistors Filed
SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Electrical Characteristics
SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Production Dimension
SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Soldering Recommendation
The principal techniques used for the soldering of components in surface mount technology are infrared reflow and wave soldering.
Wave Soldering
When wave soldering. The SMD is attach to the circuit board by means of an adhesive. The assembly is then place on a conveyor and run though the soldering process to contact the wave. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock., a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. The following is the typical profiles. WAVE SOLDER PROFILE
Reflow Soldering
When reflow soldering, the device is placed a solder paste on the substrate ,as the solder paste is heated, it re-flows and solders the unite to board. When using a reflow process ,care should be taken to ensure that the SMD is not subjected to an thermal gradient steeper than 4 degrees per second; the ideal gradient being 2degrees per second. During the soldering process, preheating to within 100 degrees of the soldier’s peak temperature is essential to minimize thermal shock. The following is typical profile.
REFLOW SOLDER PROFILE
Packaging Specification
Carrier tape transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape. The adhesion of the heat-sealed cover tape shall be 40﹢20/﹣15 grams.
Both the head and the end portion of taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator handle.
Taping Dimensions Unit:mm
Reel Dimension
Unit:mm
Packaging Quantity Unit:pcs
Enviromental Reliability Test
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