Leadless Chip Thermometrics NTC Thermistor , SMD / Surface Mount Thermistor

Leadless Chip Thermometrics NTC Thermistor , SMD / Surface Mount Thermistor

SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Feature

Ultra small size2012

Lead(pb)freeproduct.Wide operating temperature:﹣40℃ to﹢125℃.
Lowresistance and high B-value available.
Superiorheatresistance to soldering and excellent solderability.
Productconforming to ROHS directive.

SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Applications

Temprature sensor.
Temprature compensaion.

SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Filed
Equipment to mobile communication TCXOs(temperature compensated type quartz oscillator),RF circuits (power amp circuits, temperature monitoring circuits) LCD panel temperature compensated crystal oscillator, witch is the key device for mobile phones.□ Temperature compensating circuit of LCD□ Computer relate equipment
CPU periphery temperature monitoring circuits, temperature compensation circuit of optical pickup for DVD writing, temperature compensated in HDD.
DVC/DSC device
Auto-focus circuits , plunger peripheral circuits, battery circuits ,battery pack temperature control circuits.□ Equipment relate to car audio
Varistor types of pickup temperature compensation circuits, temperature compensation for various types of circuits
Optical communication related equipment
Laser transmission circuit temperature compensation

SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Electrical Characteristics

SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Production Dimension

SMD / Surface Mount Thermistor, NTC Leadless Chip Thermometrics Thermistors Soldering Recommendation

The principal techniques used for the soldering of components in surface mount technology are infrared reflow and wave soldering.

Wave Soldering

When wave soldering. The SMD is attach to the circuit board by means of an adhesive. The assembly is then place on a conveyor and run though the soldering process to contact the wave. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock., a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. The following is the typical profiles.

             WAVE SOLDER PROFILE

Reflow Soldering

When reflow soldering, the device is placed a solder paste on the substrate ,as the solder paste is heated, it re-flows and solders the unite to board. When using a reflow process ,care should be taken to ensure that the SMD is not subjected to an thermal gradient steeper than 4 degrees per second; the ideal gradient being 2degrees per second. During the soldering process, preheating to within 100 degrees of the soldier’s peak temperature is essential to minimize thermal shock. The following is typical profile.

             REFLOW SOLDER PROFILE

Packaging Specification

Carrier tape transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape.

The adhesion of the heat-sealed cover tape shall be 40﹢20/﹣15 grams.

Both the head and the end portion of taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator handle.

Taping Dimensions      Unit:mm

Reel Dimension

Unit:mm

Packaging Quantity                                  Unit:pcs

Enviromental Reliability Test