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Arlon Microwave PCB Built on AD450 30mil 0.762mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

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Shenzhen Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374946

Contact Person:
Miss.Sally Mao
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Arlon Microwave PCB Built on AD450 30mil 0.762mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

Brand Name Bicheng Technologies Limited
Model Number BIC-156-V1.00
Certification UL
Place of Origin China
Minimum Order Quantity 1
Price USD 2.99-9.99 PER PIECE
Payment Terms T/T, Western Union
Supply Ability 45000 pieces per month
Delivery Time 10 working days
Packaging Details Vacuum
Number of Layers 2
Glass Epoxy: AD450
Final foil 1.0
Final height of PCB: 0.8 mm ±10%
Surface Finish Immersion gold
Solder Mask Color: Green
Colour of Component Legend White
Test 100% Electrical Test prior shipment
Detailed Product Description

Arlon Microwave PCB Built on AD450 30mil 0.762mm DK4.5 With Immersion Gold for Circuit Board Miniaturization

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers' (Arlon) AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material for use as a printed circuit board substrate. The woven fiberglass provides better dielectric constant and thickness uniformity, better dimensional stability as well as reduced manufacturing costs.

 

The electrical properties of AD450 suggest it can readily replace FR-4 in applications where higher frequencies and expectations for increased fidelity with broadband signal are beyond the performance offered by FR-4.

 

 

With a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in higher power designs, where temperature extremes and heat rejection are primary considerations.

 

AD450 is compatible with processing used for standard PTFE based printed circuit board substrates. In addition, its low Z-axis thermal expansion will improve plated through hole reliability, compared to typical PTFE based laminates.

 

Typical Applications:

1. Circuit Board Miniaturization

2. Multimedia Transmission Systems

3. Wide Band Antenna Applications

4. Replacement of FR-4 in Higher Frequency Applications

 

Figure 1 demonstrates the stability of dielectric constant across frequency.

 

 

Figure 2 demonstrates the stability of dissipation factor across frequency.

 

 

Our PCB Capability(AD450)

PCB Material:Woven Fiberglass Re inforced, Ceramic filled, PTFE based Composite
Designation:AD450
Dielectric constant:4.5
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm), 70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 

 

Data Sheet of AD450

PropertyTest MethodConditionResult
Dielectric Constant @ 200 MHzIPC TM-650 2.5.5.6C23/504.5
Loss Tangent @ 10 GHzIPC TM-650 2.5.5.6C23/500.0035
Thermal Coefficient of ErIPC TM-650 2.5.5.6- 10℃ TO +140℃-233.5
Copper Peel Strength (lb/in)IPC TM-650 2.4.8A, TS>12
Volume Resistivity (MΩ-cm)IPC TM-650 2.5.17.1C96/35/901.2 X 109
Surface Resistivity (MΩ)IPC TM-650 2.5.17.1C96/35/904.5 X 107
Arc Resistance (seconds)ASTM D-495D48/50>180
Tensile Modulus (kpsi)ASTM D-638A, 23℃>700
Tensile Strength (kpsi)ASTM D-882A, 23℃>20
Compressive Modulus (kpsi)ASTM D-685A, 23℃>350
Flexural Modulus (kpsi)ASTM D-790A, 23℃>540
Dielectric Breakdown (kV)ASTM D-149D48/50>45
Density (g/cm3)ASTM D-792 Method AA, 23℃2.45
Water Absorption (%)IPC TM-650 2.6.2.2E1/105 + D24/230.07
Coefficient of Thermal Expansion (ppm/℃) X Axis Y Axis Z AxisIPC TM-650 2.4.24 TMA0℃ to 100 ℃8 11 42
Thermal Conductivity (W /mK)ASTM E-1225100℃0.38
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor RecoveredNASA SP-R-0022A Maximum 1.00% Maximum 0.10%125℃, ≦10-6 torr0.01 0.01 0.00
FlammabilityUL 94 Vertical BurnC48/23/50, E24/125UL94-V0

 

 

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