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Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication

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Shenzhen Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374946

Contact Person:
Miss.Sally Mao View Contact Details

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication

Brand Name	Bicheng Technologies Limited
Model Number	BIC-0036-V0.73
Certification	UL
Place of Origin	China
Minimum Order Quantity	1
Price	USD 2.99-9.99 PER PIECE
Payment Terms	T/T, Western Union
Supply Ability	45000 pieces per month
Delivery Time	10 working days
Packaging Details	Vacuum
Number of Layers	2
Glass Epoxy:	TLY-3
Final foil	1.0 Oz
Final height of PCB:	0.8 mm ±10%
Surface Finish	Immersion Gold
Solder Mask Color:	No
Colour of Component Legend	NO
Test	100% Electrical Test prior shipment

Detailed Product Description

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Taconic TLY laminates are a type of low loss laminates. They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.

Benefits:

Dimensionally stable

Lowest DF

Low moisture absorption

High copper peel strength

Uniform & consistent DK

Laser ablatable

Applications:

Automotive radar

Satellite/cellular communications

Power amplifiers

LNBs, LNAs, LNCs

Aerospace

Ka, E and W band applications

PCB Specifications

PCB SIZE	100 x 90mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	TLY-3 0.762mm
	copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.4mm
Number of Different Holes:	1
Number of Drill Holes:	1
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	TLY-3 0.762mm
Final foil external:	1oz
Final foil internal:	N/A
Final height of PCB:	0.8 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold (31%)
Solder Mask Apply To:	NO
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Side
Colour of Component Legend	white
Manufacturer Name or Logo:	Marked on the board in a conductor and legend FREE AREA
VIA	N/A
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5		2.2		2.2
Df at 10 GHz	IPC-650 2.5.5.5		0.0009		0.0009
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Dielectric Strength	ASTM D 149	V/mil	2,693	V/mil	106,023
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	1010	Mohms/cm	1010
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	1010	Mohms/cm	109
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	108	Mohms	108
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	108	Mohms	108
Flex Strength(MD)	IPC-650 2.4.4	psi	14,057	N/mm2	96.91
Flex Strength(CD)	IPC-650 2.4.4	psi	12,955	N/mm2	89.32
Peel Stength(½ oz.ed copper)	IPC-650 2.4.8	Ibs./inch	11	N/mm	1.96
Peel Stength(1 oz.CL1 copper)	IPC-650 2.4.8	Ibs./inch	16	N/mm	2.86
Peel Stength(1 oz..CV1 copper)	IPC-650 2.4.8	Ibs./inch	17	N/mm	3.04
Peel Stength	IPC-650 2.4.8(after elevated temp.)	Ibs./inch	13	N/mm	2.32
Young's Modulus(MD)	ASTM D 3039/IPC-650 2.4.19	psi	1.4 x 106	N/mm2	9.65 x 103
Poisson's Ratio(MD)	ASTM D 3039/IPC-650 2.4.19		0.21		0.21
Thermal Conductivity	ASTM F 433	W/M*K	0.22	W/M*K	0.22
Dimensional Stability(MD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.038		-0.038
Dimensional Stability(CD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.031		-0.031
Density(Specific Gravity)	ASTM D 792	g/cm3	2.19	g/cm3	2.19
CTE(X axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	26	ppm/℃	26
CTE(Y axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	15	ppm/℃	15
CTE(Z axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	217	ppm/℃	217
NASA Outgassing(% TML)			0.01		0.01
NASA Outgassing(% CVCM)			0.01		0.01
NASA Outgassing(% WVR)			0.00		0.00
UL-94 Flammability Rating	UL-94		V-0		V-0

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